Reversible metal-insulator transitions in metallic single-walled carbon nanotubes.

We report on reversible metal to insulator transitions in metallic single-walled carbon nanotube devices induced by repeated electron irradiation of a nanotube segment. The transition from a low-resistive, metallic state to a high-resistive, insulating state by 3 orders of magnitude was monitored by electron transport measurements. Application of a large voltage bias leads to a transition back to the original metallic state. Both states are stable in time, and transitions are fully reversible and reproducible. The data is evidence for a local perturbation of the nanotube electronic system by removable trapped charges in the underneath substrate and excludes structural damage of the nanotube. The result has implications for using electron-beam lithography in nanotube device fabrication.

Influence of structural and dielectric anisotropy on the dielectrophoresis of single-walled carbon nanotubes.

We report on a carbon nanotube network which is composed of aligned metallic and randomly oriented semiconducting single-walled carbon nanotubes. The material is formed by using a novel radio frequency dielectrophoresis setup, which generates very large dielectrophoretic force fields and allows dielectrophoretic assembling of nanotube films up to 100 nm thickness. Polarization dependent absorption measurements provide experimental evidence for the electronic type specific alignment behavior. We explain the experimental data with an advanced model for nanotube dielectrophoresis, which explicitly takes into account both the longitudinal and transversal polarizability. On the basis of this model, we calculate the dielectrophoretic force fields and show that semiconducting nanotubes deposit under very large fields due to their transversal polarizability even for high field frequencies.

Ultra-large-scale directed assembly of single-walled carbon nanotube devices.

One of the biggest limitations of conventional carbon nanotube device fabrication techniques is the inability to scale up the processes to fabricate a large number of devices on a single chip. In this report, we demonstrate the directed and precise assembly of single-nanotube devices with an integration density of several million devices per square centimeter, using a novel aspect of nanotube dielectrophoresis. We show that the dielectrophoretic force fields change incisively as nanotubes assemble into the contact areas, leading to a reproducible directed assembly which is self-limiting in forming single-tube devices. Their functionality has been tested by random sampling of device characteristics using microprobes.