Dual-Backplate CMUTs With Wide Bandwidth and Low Driving Voltage for Airborne Applications.

In this work, novel airborne capacitive micromachined ultrasonic transducers (CMUTs) based on a dual-backplate (DBP) technology are presented. In contrast to conventional CMUTs, these transducers use a three-electrode-based capacitive system, where the membrane is placed between two highly-perforated counter electrodes, enabling enlarged displacement amplitudes in electrostatic actuation and wide and tunable bandwidth (BW) due to a ventilated air cavity. Fabricated DBP-CMUT prototypes therefore show exceptionally high receive and transmit sensitivities of -34.5 dB(V/Pa) and 259 nm/V, respectively, in their 84-kHz resonance. The viscous dissipation introduced by ventilating the cavity results in a wide factional BW (FBW) of 29%. Applicability of the developed CMUT for airborne ranging is demonstrated in pulse-echo-based ranging measurements, where the distance of a sound-reflecting metal plate can be clearly detected by a single CMUT operated in a transceiver mode.

Ultra-Low-Voltage Capacitive Micromachined Ultrasonic Transducers with Increased Output Pressure Due to Piston-Structured Plates.

Capacitive micromachined ultrasonic transducers (CMUTs) represent an accepted technology for ultrasonic transducers, while high bias voltage requirements and limited output pressure still need to be addressed. In this paper, we present a design for ultra-low-voltage operation with enhanced output pressure. Low voltages allow for good integrability and mobile applications, whereas higher output pressures improve the penetration depth and signal-to-noise ratio. The CMUT introduced has an ultra-thin gap (120 nm), small plate thickness (800 nm), and is supported by a non-flexural piston, stiffening the topside for improved average displacement, and thus higher output pressure. Three designs for low MHz operation are simulated and fabricated for comparison: bare plate, plate with small piston (34% plate coverage), and big piston (57%). The impact of the piston on the plate mechanics in terms of resonance and pull-in voltage are simulated with finite element method (FEM). Simulations are in good agreement with laser Doppler vibrometer and LCR-meter measurements. Further, the sound pressure output is characterized in immersion with a hydrophone. Pull-in voltages range from only 7.4 V to 25.0 V. Measurements in immersion with a pulse at 80% of the pull-in voltage present surface output pressures from 44.7 kPa to 502.1 kPa at 3.3 MHz to 4.2 MHz with a fractional bandwidth of up to 135%. This leads to an improvement in transmit sensitivity in pulsed (non-harmonic) driving from 7.8 kPa/V up to 24.8 kPa/V.

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers.

Fan-out wafer-level packaging (FOWLP) is an interesting platform for Microelectromechanical systems (MEMS) sensor packaging. Employing FOWLP for MEMS sensor packaging has some unique challenges, while some originate merely from the fabrication of redistribution layers (RDL). For instance, it is crucial to protect the delicate structures and fragile membranes during RDL formation. Thus, additive manufacturing (AM) for RDL formation seems to be an auspicious approach, as those challenges are conquered by principle. In this study, by exploiting the benefits of AM, RDLs for fan-out packaging of capacitive micromachined ultrasound transducers (CMUT) were realized via drop-on-demand inkjet printing technology. The long-term reliability of the printed tracks was assessed via temperature cycling tests. The effects of multilayering and implementation of an insulating ramp on the reliability of the conductive tracks were identified. Packaging-induced stresses on CMUT dies were further investigated via laser-Doppler velocimetry (LDV) measurements and the corresponding resonance frequency shift. Conclusively, the bottlenecks of the inkjet-printed RDLs for FOWLP were discussed in detail.

Acoustic transmission line based modelling of microscaled channels and enclosures.

An analytical model is presented that describes the acoustical impedance of cylindrical tubes and concentrically connected systems of such tubes valid up to the ultrasonic application. This allows the evaluation of microsized geometries encountered in acoustical microdevices, such as housing enclosures and sound port Helmholtz resonators. Each tube is treated as an acoustic transmission line (TL). Connected tubes are described using a coupling impedance, which accounts for viscous and inertial effects due to duct size changes. The acoustic TL model is directly derived from Navier-Stokes and energy equation, including frequency dependent boundary layer effects of the viscous and thermal dissipation. The results for various evaluated enclosure and resonator geometries are in good agreement with finite element method (FEM) simulation in both audio and ultrasonic frequency range and are compared to dedicated lumped element models referenced in literature. The presented model provides benefits in three ways: it is faster than FEM simulation and allows an implementation into analytical models and circuit simulation tools. Finally, it allows geometries with characteristic dimensions close to and above the wavelength to be treated with high precision in contrast to lumped element models.