RESUMO
Vertical light-emitting diodes (VLEDs) have attracted considerable attention owing to their improved thermal, electrical, and optical performance compared to conventional LEDs. To fabricate VLEDs, a bonding technique is required following laser lift-off. Eutectic bonding techniques are preferred owing to their low-heat mechanism and production safety. However, the conventional resistance heating method for eutectic bonding process, the extremely longer process time becomes a problem such as cost rise, wapage. In this study, the thermal efficiency was measured according to the diameter of the coil in order to optimize the eutectic bonding of the RF induction heating method in order to solve this problem. We confirmed that successful eutectic bonding is possible with less than 30 min processing using Sn-Glass. In addition, Au (20 wt%)/Sn (80 wt%) alloy, a mainly used the eutectic bonding interlayer material for VLEDs, can also be used as an interlayer to provide void-free eutectic bonding in less than 30 min.
