Non-Contact Optical Detection of Foreign Materials Adhered to Color Filter and Thin-Film Transistor.

This paper describes the non-contact optical detection of debris material that adheres to the substrates of color filters (CFs) and thin-film transistors (TFTs) by area charge-coupled devices (CCDs) and laser sensors. One of the optical detections is a side-view illumination by an area CCD that emits a coherency light to detect debris on the CF. In contrast to the height of the debris material, the image is acquired by transforming the geometric shape from a square to a circle. As a result, the side-view illumination from the area CCD identified the height of the debris adhered to the black matrix (BM) as well as the red, green, and blue of a CF with 95, 97, 98, and 99% accuracy compared to the golden sample. The uncertainty analysis was at 5% for the BM, 3% for the red, 2% for the green, and 1% for the blue. The other optical detection, a laser optical interception with a horizontal alignment, inspected the material foreign to the TFT. At the same time, laser sensors intercepted the debris on the TFT at a voltage of 3.5 V, which the five sets of laser optics make scanning the sample. Consequently, the scanning rate reached over 98% accuracy, and the uncertainty analysis was within 5%. Thus, both non-contact optical methods can detect debris at a 50 µm height or lower. The experiment presents a successful design for the efficient prevention of a valuable component malfunction.

Detection of Electrical Circuit in a Thin-Film-Transistor Liquid-Crystal Display Using a Hybrid Optoelectronic Apparatus: An Array Tester and Automatic Optical Inspection.

In this study, we developed a high-resolution, more accurate, non-destructive apparatus for refining the detection of electrode pixels in a thin-film-transistor liquid-crystal display (TFT-LCD). The hybrid optoelectronic apparatus simultaneously uses an array tester linked with the automatic optical inspection of panel defects. Unfortunately, due to a tiny air gap in the electro-optical inspector, the situation repeatedly causes numerous scratches and damages to the modulator; therefore, developing alternative equipment is necessary. Typically, in TFT-LCDs, there are open, short, and cross short electrical defects. The experiment utilized a multiple-line scan with the time delay integration (TDI) of a charge-coupled device (CCD) to capture a sharp image, even under low light, various speeds, or extreme conditions. In addition, we explored the experimental efficacy of detecting the electrode pixel of the samples and evaluated the effectiveness of a 7-inch opaque quartz mask. The results show that an array tester and AOI can detect a TFT-LCD electrode pixel sufficiently; therefore, we recommend adopting the hybrid apparatus in the TFT-LCD industry.

Light Emitted Diode on Detecting Thin-Film Transistor through Line-Scan Photosensor.

This paper explores the effectiveness of the white, red, green, and blue light emitted diodes (LEDs) light sources to detect the third layer of the electrode pixel and the fourth layer of the via-hole passivation on thin-film transistors. The time-delay-integration charge-coupled device and a reflective spectrometer were implemented in this experiment. The optical conditions are the same, as each light source and the digital image's binary method also recognize the sharpness and contrast in the task. Consequently, the white and the blue LED light sources can be candidates for the light source for the optical inspection, especially for monochromic blue LED's outperformance among the light sources. The blue LED demonstrates the high spatial resolution and short wavelength's greater energy to trigger the photosensor. Additionally, the metal material has shown a tremendous responsibility in the photosensor with 150 Dn/nj/cm2 over the sensibility. The mercury 198Hg-pencil discharge lamp emits the stable spectral wavelength to significantly calibrate the spectrometer's measurement.