RESUMO
Matching the resonant wavelength of plasmonic nanoparticles (NPs) and the emission band of organic materials is critical for achieving optimal plasmon-enhanced luminescence in organic light-emitting devices (OLEDs). However, the spectral matching is often unsatisfactory because the interior architecture of OLEDs limits the dimensions of the NPs to support the desired wavelength adjustment. In this article, we proposed a design strategy via AuxAg1-x alloy NPs to enable resonance tuning while preserving the size of the NP to suit the OLED design requirements. The bimetallic NPs, especially for x < 0.6, not only add one more degree of freedom to vary the plasmon wavelength but also provide the benefits of higher scattering and more intense and outspread electric fields over a broader spectrum compared to Au monometallic NPs. These features allow smaller NPs, which are more compatible with OLED interiors, to scatter electric fields more efficiently and increase the density of molecules interacting with the NP plasmons. In the presence of a nearby dipole emitter, the bimetallic NPs can simultaneously increase radiative enhancement and suppress non-radiative losses, which are advantageous for increasing the quantum yield and luminescence efficiency of the emitter. These improvements are associated with lower intraband and interband activities resulting from the higher molar fraction of Ag in the alloy NPs. We provided composition mappings to achieve enhanced luminescence for specified wavelengths at fixed NP sizes. Finally, we theoretically demonstrated that the bimetallic NPs could improve the light-extraction efficiency of OLEDs better than Au monometallic NPs. This work provides essential guidance to enable versatile plasmon-enhanced applications with predefined nanostructural geometries and wavelengths to match the device requirements.
RESUMO
A novel hardware design and preliminary experimental results for photoacoustic imaging are reported in this paper. This imaging system makes use of an infrared-transparent capacitive micromachined ultrasonic transducer (CMUT) chip for ultrasound reception and illuminates the image target through the CMUT array. The cascaded arrangement between the light source and transducer array allows for a more compact imager head and results in more uniform illumination. Taking advantage of the low optical absorption coefficient of silicon in the near infrared spectrum as well as the broad acoustic bandwidth that CMUTs provide, an infrared-transparent CMUT array has been developed for ultrasound reception. The center frequency of the polysilicon-membrane CMUT devices used in this photoacoustic system is 3.5 MHz, with a fractional bandwidth of 118% in reception mode. The silicon substrate of the CMUT array has been thinned to 100 µm and an antireflection dielectric layer is coated on the back side to improve the infrared-transmission rate. Initial results show that the transmission rate of a 1.06-µm Nd:Yag laser through this CMUT chip is 12%. This transmission rate can be improved if the thickness of silicon substrate and the thin-film dielectrics in the CMUT structure are properly tailored. Imaging of a metal wire phantom using this cascaded photoacoustic imager is demonstrated.
