Simple fabrication of a double-layer multi-channel optical waveguide using passive alignment.

This study proposes a simple and cost-effective method of fabricating a double-layer polymeric optical waveguide, using two hot-embossing processes with a single stamp and template for passive alignment between the top and bottom layers. The two hot-embossing processes were conducted sequentially on the top layer and the bottom layer of the polymer layer. The second hot-embossing process was conducted after fabricating the buffer layer on the surface of the polymeric channel structure to control deformation and destruction of the previously fabricated polymeric channel structure. Passive alignment of the channel structure for the top layer and the bottom layer was automatically performed by simple insertion of the stamp and polymer layer using a metal template with the same dimensions (width x length) as the stamp. Regarding the polymer layer, the buffer layer on the side with the channel structure was coated, whereas the layer contacting the stamp did not have a buffer layer. For the purposes of this study, a 2 x 50 channel polymeric multimode optical waveguide was fabricated using a stamp with 50 straight ribs, without any coupling between the layers. The fabricated optical waveguide was controlled within positional tolerances of less than ± 5 µm between layers; propagation loss of below 0.2 dB/cm at 850 nm; and channel uniformity of below 0.5 dB.

Fabrication of thermally stable and cost-effective polymeric waveguide for optical printed-circuit board.

A thermally stable polymeric optical waveguide has been fabricated using ultraviolet (UV)-curable epoxy resins for the core and clad materials. A simple and cost-effective fabrication method that uses reusable polydimethylsiloxane (PDMS) masters has been developed. The 12-channel under-clad layer of the UV-cured epoxy was prepared using a PDMS master whose embossed channels had been fabricated by a polycarbonate (PC) secondary master. The thermal stability of the fabricated waveguide was tested at 200 degrees C for one hour. The optical waveguide was not damaged physically by thermal stress. Propagation losses detected by a cut-back method were 0.16 dB/cm and 0.26 dB/cm, respectively, before and after the thermal stability test at 850 nm. Loss increase after the thermal treatment can be attributed to the formation of the absorbing and scattering sources. This waveguide can be applied for areas that require thermal stability such as an optical printed-circuit board.

Interchip link system using an optical wiring method.

A chip-scale optical link system is presented with a transmitter/receiver and optical wire link. The interchip link system consists of a metal optical bench, a printed circuit board module, a driver/receiver integrated circuit, a vertical cavity surface-emitting laser/photodiode array, and an optical wire link composed of plastic optical fibers (POFs). We have developed a downsized POF and an optical wiring method that allows on-site installation with a simple annealing as optical wiring technologies for achieving high-density optical interchip interconnection within such devices. Successful data transfer measurements are presented.

Experimental demonstration of 10 Gbit/s transmission with an optical backplane system using optical slots.

A practical optical backplane system was prepared with transmitter-receiver processing boards and an optical backplane made from polymeric-waveguide-embedded optical printed-circuit boards. Optical slots were used as connection components between the transmitter-receiver processing boards and the backplane board to permit easy and repeatable insertion and extraction of the boards with micrometer precision. We report 10 Gbit/s data transmission between an optical backplane and the transmitter-receiver processing boards.