Author Correction: Understanding the effect of wet etching on damage resistance of surface scratches.

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Understanding the effect of wet etching on damage resistance of surface scratches.

Fused silica optics often exhibit surface scratches after polishing that radically reduce their damage resistance at the wavelength of 351 nm in the nanosecond regime. Consequently, chemical treatments after polishing are often used to increase the damage threshold and ensure a safe operation of these optics in large fusion-scale laser facilities. Here, we investigate the reasons for such an improvement. We study the effect of an HF-based wet etching on scratch morphology and propose a simple analytic model to reflect scratch widening during etching. We also use a finite element model to evaluate the effect of the morphological modification induced by etching on the electric field distribution in the vicinity of the scratch. We evidence that this improvement of the scratch damage resistance is due to a reduction of the electric field enhancement. This conclusion is supported by secondary electron microscopy (SEM) imaging of damage sites initiated on scratches after chemical treatment.

Effects of deep wet etching in HF/HNO3 and KOH solutions on the laser damage resistance and surface quality of fused silica optics at 351 nm.

We investigate the interest of deep wet etching with HF/HNO3 or KOH solutions as a final step after polishing to improve fused silica optics laser damage resistance at the wavelength of 351 nm. This comparison is carried out on scratches engineered on high damage threshold polished fused silica optics. We evidence that both KOH and HF/HNO3 solutions are efficient to passivate scratches and thus improve their damage threshold up to the level of the polished surface. The effect of these wet etchings on surface roughness and aspect is also studied. We show that KOH solution exhibit better overall surface quality that HF/HNO3 solution in the tested conditions. Given the safety difficulties associated with the processing with HF, KOH solution appears as a pertinent alternative to HF deep wet etching.

Laser-induced birefringence measurements by quantitative polarized-phase microscopy.

A technique that provides quantitative and spatially resolved retardance measurement is studied for application to laser-induced modification in transparent materials. The method is based on the measurement of optical path differences between two wavefronts carrying different polarizations, measured by a wavefront sensor placed in the image plane of a microscope. We have applied the technique to the investigation of stress distribution induced by CO2 laser processing of fused silica samples. By comparing experiments to the results of thermomechanical simulations we demonstrate quantitative agreement between measurements and simulations of optical retardance. The technique provides an efficient and simple way to measure retardance of less than 1 nm with a diffraction-limited spatial resolution in transparent samples, and coupled to thermomechanical simulations it gives access to birefringence distribution in the sample.

Using STED and ELSM confocal microscopy for a better knowledge of fused silica polished glass interface.

Characteristics and nature of close surface defects existing in fused silica polished optical surfaces were explored. Samples were deliberately scratched using a modified polishing process in presence of different fluorescent dyes. Various techniques including Epi-fluorescence Laser Scanning Mode (ELSM) or STimulated Emission Depletion (STED) confocal microscopy were used to measure and quantify scratches that are sometimes embedded under the polished layer. We show using a non-destructive technique that depth of the modified region extends far below the surface. Moreover cracks of 120 nm width can be present ten micrometers below the surface.

Loose abrasive slurries for optical glass lapping.

Loose abrasive lapping is widely used to prepare optical glass before its final polishing. We carried out a comparison of 20 different slurries from four different vendors. Slurry particle sizes and morphologies were measured. Fused silica samples were lapped with these different slurries on a single side polishing machine and characterized in terms of surface roughness and depth of subsurface damage (SSD). Effects of load, rotation speed, and slurry concentration during lapping on roughness, material removal rate, and SSD were investigated.

Initiation of laser-induced damage sites in fused silica optical components.

Significant improvement in the polishing process of fused silica optical components has increased their lifetimes at 351 nm. Nevertheless, for large laser facilities like the LaserMegaJoule (LMJ), zero defect optical components are not yet available. Therefore, a damage mitigation technique has been developed to prevent the growth of the laser-initiated damage sites. Because of the difficulty to produce mitigated sites with sufficiently large depth, the initial morphology of damage to mitigate is a critical issue. The aim of this work is to determine laser parameters (pulse duration, fluence) which permit us to initiate damage sites in accordance with our mitigation process. Confocal microscopy is used to observe damage sites that have sub-surface cracks and consequently to measure precisely the diameter and the depth of the area to mitigate.

Investigation of stress induced by CO2 laser processing of fused silica optics for laser damage growth mitigation.

Laser damage mitigation' is a process developed to prevent the growth of nanosecond laser-initiated damage sites under successive irradiation. It consists of re-fusing the damage area with a CO2 laser. In this paper we investigate the stress field created around mitigated sites which could have an influence on the efficiency of the process. A numerical model of CO2 laser interaction with fused silica is developed. It takes into account laser energy absorption, heat transfer, thermally induced stress and birefringence. Residual stress near mitigated sites in fused silica samples is characterized with specific photoelastic methods and theoretical data are compared to experiments. The stress distribution and quantitative values of stress levels are obtained for sites treated with the CO2 laser in various conditions of energy deposition (beam size, pulse duration, incident power). The results provided evidence that the presence of birefringence/residual stress around the mitigated sites has an effect on their laser damage resistance.