Depth estimation of surface cracks on metallic components by means of lock-in thermography.

In this work, a new method to characterize vertical cracks by lock-in thermography is presented. The heat transfer process induced by a modulated thermal excitation located in the vicinity of the crack is simulated using a finite element method computer package. The propagation of heat flow along the solid surface is disturbed when crossing an inhomogeneity. The disturbance of the thermal-wave allows a quantitative analysis of the crack. The main idea consists of exploiting the second derivative of the amplitude image in order to highlight the useful signal. In addition, an image analysis procedure based on the use of Laplacian calculations is proposed. To support this approach, experimental tests were performed and compared with mathematical simulations. The results demonstrate the potential of active lock-in thermography as a contactless tool for crack-depth estimation.

Simultaneous characterization of optical and thermal parameters of liquid-crystal nanocolloids with high-temperature resolution.

We report on the high-temperature resolution measurements of the optical and thermal parameters of a liquid-crystal-silica nanoparticle colloid, as well as its video inspection, simultaneously performed in an upgraded photopyroelectric calorimeter. Over the nematic-isotropic coexistence region, the determined nematic correlation length, obtained from turbidity measurements, showed the characteristic two-step nematic nucleation process previously reported only for the specific heat.

On the accurate determination of thermal diffusivity of liquids by using the photopyroelectric thickness scanning method.

An enhanced accurate method of measuring the thermal diffusivity of liquids by the sample's thickness scan of the phase of the photopyroelectric signal is presented. The method, making use of the absolute values of the phase and sample thickness, leads to very accurate results for the room temperature values of thermal diffusivity (about +/-0.3%). The high accuracy of the method is due to a very precise control of the sample's thickness variation (0.1 microm step), to a proper localization of the thickness scan range, and to a new procedure of data analysis. The high accuracy of the method recommends it for the study of processes associated with small changes of the thermal parameters.