The role of microstructure in the thermal fatigue of solder joints.

Thermal fatigue is a common failure mode in electronic solder joints, yet the role of microstructure is incompletely understood. Here, we quantify the evolution of microstructure and damage in Sn-3Ag-0.5Cu joints throughout a ball grid array (BGA) package using EBSD mapping of localised subgrains, recrystallisation and heavily coarsened Ag3Sn. We then interpret the results with a multi-scale modelling approach that links from a continuum model at the package/board scale through to a crystal plasticity finite element model at the microstructure scale. We measure and explain the dependence of damage evolution on (i) the ß-Sn crystal orientation(s) in single and multigrain joints, and (ii) the coefficient of thermal expansion (CTE) mismatch between tin grains in cyclic twinned multigrain joints. We further explore the relative importance of the solder microstructure versus the joint location in the array. The results provide a basis for designing optimum solder joint microstructures for thermal fatigue resistance.

On rate-dependent polycrystal deformation: the temperature sensitivity of cold dwell fatigue.

A temperature and rate-dependent crystal plasticity framework has been used to examine the temperature sensitivity of stress relaxation, creep and load shedding in model Ti-6Al polycrystal behaviour under dwell fatigue conditions. A temperature close to 120°C is found to lead to the strongest stress redistribution and load shedding, resulting from the coupling between crystallographic slip rate and slip system dislocation hardening. For temperatures in excess of about 230°C, grain-level load shedding from soft to hard grains diminishes because of the more rapid stress relaxation, leading ultimately to the diminution of the load shedding and hence, it is argued, the elimination of the dwell debit. Under conditions of cyclic stress dwell, at temperatures between 20°C and 230°C for which load shedding occurs, the rate-dependent accumulation of local slip by ratcheting is shown to lead to the progressive cycle-by-cycle redistribution of stress from soft to hard grains. This phenomenon is termed cyclic load shedding since it also depends on the material's creep response, but develops over and above the well-known dwell load shedding, thus providing an additional rationale for the incubation of facet nucleation.

Micro-scale testing and micromechanical modelling for high cycle fatigue of CoCr stent material.

This paper presents a framework of experimental testing and crystal plasticity micromechanics for high cycle fatigue (HCF) of micro-scale L605 CoCr stent material. Micro-scale specimens, representative of stent struts, are manufactured via laser micro-machining and electro-polishing from biomedical grade CoCr alloy foil. Crystal plasticity models of the micro-specimens are developed using a length scale-dependent, strain-gradient constitutive model and a phenomenological (power-law) constitutive model, calibrated from monotonic and cyclic plasticity test data. Experimental microstructural characterisation of the grain morphology and precipitate distributions is used as input for the polycrystalline finite element (FE) morphologies. Two microstructure-sensitive fatigue indicator parameters are applied, using local and non-local (grain-averaged) implementations, for the phenomenological and length scale-dependent models, respectively, to predict fatigue crack initiation (FCI) in the HCF experiments.