Synthesis of PbTe nanowire arrays using lithographically patterned nanowire electrodeposition.

We describe the preparation by electrodeposition of arrays of lead telluride (PbTe) nanowires using the lithographically patterned nanowire electrodeposition (LPNE) method. PbTe nanowires had a rectangular cross-section with adjustable width and height ranging between 60-400 nm (w) and 20-100 nm (h). The characterization of these nanowire arrays using X-ray diffraction, transmission electron microscopy and electron diffraction, scanning electron microscopy, atomic force microscopy, and X-ray photoelectron spectroscopy (XPS) is reported. PbTe nanowires were electrodeposited using a cyclic electrodeposition-stripping technique that produced polycrystalline, stoichiometric, face-centered cubic PbTe with a mean grain diameter of 10-20 nm. These nanowires were more than 1 mm in length and two additional processing steps permitted their suspension across 25 microm air gaps microfabricated on these surfaces. The LPNE synthesis of lithographically patterned PbTe nanowires was carried out in unfiltered laboratory air. Nanowires with lengths of 70-100 microm showed an electrical resistivity comparable to bulk PbTe. XPS reveals that exposure of PbTe nanowires to air causes the formation on the nanowire surface of approximately one monolayer of a mixed lead oxide and tellurium oxide within a few minutes.

Electrodeposited submicron thermocouples with microsecond response times.

We describe a procedure for preparing submicron scale silver-nickel thermocouples (TCs) using electrochemical step edge decoration on graphite surfaces. Each fabrication operation produced ensembles of 2-20 TCs with diameters in the 1.0 microm to 500 nm range. These "sub-mum TCs" (SMTCs) produced linear voltage versus temperature output over the range from 20 to 100 degrees C characterized by a Seebeck coefficient of 20 +/- 1 microV/degrees C, equal to the 21 microV/degrees C that is theoretically expected for a junction between these two metals. The time response of SMTCs was evaluated using two different laser-heating methods and compared with the smallest mechanically robust commercially available type J TCs. Electrochemical etching of the silver wire introduced constrictions at grain boundaries that reduced the thermal mass of the junction without altering its integrity or its overall diameter, producing a decrease of the measured rise time for SMTCs up to 96%.