RESUMO
With the increasing processing power of micro-electronic components and increasing spatial limitations, ensuring sufficient heat dissipation has become a crucial task. This work presents a microscopic approach to increasing the surface area through periodic surface structures. Microstructures with a periodic distance of 8.5 µm are fabricated via Direct Laser Interference Patterning (DLIP) on stainless steel plates with a nanosecond-pulsed infrared laser and are characterized by their developed interfacial area ratio. The optimal structuring parameters for increasing the surface area were investigated, reaching peak-to-valley depths up to 12.8 µm and increasing surface area by up to 394%. Heat dissipation in a natural convection environment was estimated by measuring the output voltage of a Peltier element mounted between a hot plate and a textured sample. The resulting increase in output voltage compared to an unstructured sample was correlated to the structure depth and developed interfacial area ratio, finding a maximum increase of 51.4%. Moreover, it was shown that the output voltage correlated well with the structure depth and surface area.
