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1.
Micromachines (Basel) ; 15(6)2024 May 21.
Artigo em Inglês | MEDLINE | ID: mdl-38930639

RESUMO

With the continuous development of wireless communication technology, the frequency band of 6G communication systems is moving towards higher frequencies such as millimeter waves and terahertz. In such high-frequency situations, wireless transmission requires antenna modules to be provided with characteristics of miniaturization, high integration, and high gain, which presents new challenges to the development of antenna technology. In this article, a 4 × 4 antenna array using multilayered low-temperature co-fired ceramic is proposed, operating in W-band, with a feeding network based on substrate-integrated waveguide, and an antenna element formed through the combination of a substrate-integrated cavity and surface parasitic patches, which guaranteed the array to possess the advantages of high integration and high gain. Combined with the substrate-integrated waveguide to a rectangular waveguide transition structure designed in the early stage, a physical array with a standard metal rectangular waveguide interface was fabricated and tested. The test results show that the gain of the antenna array is higher than 18 dBi from 88 to 98 GHz, with a maximum of 20.4 dBi.

2.
Micromachines (Basel) ; 14(1)2022 Dec 25.
Artigo em Inglês | MEDLINE | ID: mdl-36677114

RESUMO

In this paper, a novel wideband transition from a laminated waveguide (LWG) to an air-filled rectangular waveguide (RWG) is proposed for millimeter-wave integration solutions based on multilayer low-temperature co-fired ceramic (LTCC) technology. The integrated transition cavity is divided into several resonators by introducing five grounded via holes. Due to the magnetic wall existing in the symmetry plane, the equivalent circuit of the proposed transition can be simplified as a three-pole filter model to explain the working mechanism with wideband performance. A W-band integrated LWG-to-RWG transition is designed as an example using LTCC technology. Two back-to-back prototypes with different lengths are fabricated and measured. A measured 25.7% bandwidth from 76 GHz to 101 GHz can be achieved for return loss better than 14 dB. The average insertion loss of a single transition is about 0.5 dB. The compact structure and wideband performance give it potential in high-density millimeter-wave and terahertz packaging.

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