Influence of a Flat Polyimide Inlay on the Propagation of Guided Ultrasonic Waves in a Narrow GFRP-Specimen.

Structural health monitoring systems for composite laminates using guided ultrasonic waves become more versatile with the structural integration of sensors. However, the data generated within these sensors have to be transmitted from the laminate to the outside, where polyimide-based printed circuit boards play a major role. This study investigates, to what extent integrated polyimide inlays with applied sensor bodies influence the guided ultrasonic wave propagation in glass fiber-reinforced polymer specimens. For reasons of resource efficiency, narrow specimens are used. Numerical simulations of a damping-free specimen indicate reflections of the S0-mode at the integrated inlay. This is validated experimentally with an air-coupled ultrasonic technique and a 3D laser Doppler vibrometry measurement. The experimental data are evaluated with a method including temporal and spatial continuous wavelet transformations to clearly identify periodically occurring wave packages as edge reflections and distinguish them from possible inlay reflections. However, even when separating in-plane and out-of-plane movements using the 3D measurement, no reflections at the inlays are detected. This leads to the conclusion that polyimide inlays are well suited as substrates for printed circuit boards integrated into fiber-reinforced polymer structures for structural health monitoring, since they do not significantly influence the wave propagation.

MEMS Vibrometer for Structural Health Monitoring Using Guided Ultrasonic Waves.

Structural health monitoring of lightweight constructions made of composite materials can be performed using guided ultrasonic waves. If modern fiber metal laminates are used, this requires integrated sensors that can record the inner displacement oscillations caused by the propagating guided ultrasonic waves. Therefore, we developed a robust MEMS vibrometer that can be integrated while maintaining the structural and functional compliance of the laminate. This vibrometer is directly sensitive to the high-frequency displacements from structure-borne ultrasound when excited in a frequency range between its first and second eigenfrequency. The vibrometer is mostly realized by processes earlier developed for a pressure sensor but with additional femtosecond laser ablation and encapsulation. The piezoresistive transducer, made from silicon, is encapsulated between top and bottom glass lids. The eigenfrequencies are experimentally determined using an optical micro vibrometer setup. The MEMS vibrometer functionality and usability for structural health monitoring are demonstrated on a customized test rig by recording application-relevant guided ultrasonic wave packages with a central frequency of 100 kHz at a distance of 0.2 m from the exciting ultrasound transducer.

Stainless-Steel Antenna on Conductive Substrate for an SHM Sensor System with High Power Demand.

This paper presents the novel concept of structuring a planar coil antenna structured into the outermost stainless-steel layer of a fiber metal laminate (FML) and investigating its performance. Furthermore, the antenna is modified to sufficiently work on inhomogeneous conductive substrates such as carbon-fiber-reinforced polymers (CFRP) independent from their application-dependent layer configuration, since the influence on antenna performance was expected to be configuration-dependent. The effects of different stack-ups on antenna characteristics and strategies to cope with these influences are investigated. The purpose was to create a wireless self-sustained sensor node for an embedded structural health monitoring (SHM) system inside the monitored material itself. The requirements of such a system are investigated, and measurements on the amount of wireless power that can be harvested are conducted. Mechanical investigations are performed to identify the antenna shape that produces the least wound to the material, and electrical investigations are executed to prove the on-conductor optimization concept. Furthermore, a suitable process to fabricate such antennas is introduced. First measurements fulfilled the expectations: the measured antenna structure prototype could provide up to 11 mW to a sensor node inside the FML component.

Robust Pressure Sensor in SOI Technology with Butterfly Wiring for Airfoil Integration.

Current research in the field of aviation considers actively controlled high-lift structures for future civil airplanes. Therefore, pressure data must be acquired from the airfoil surface without influencing the flow due to sensor application. For experiments in the wind and water tunnel, as well as for the actual application, the requirements for the quality of the airfoil surface are demanding. Consequently, a new class of sensors is required, which can be flush-integrated into the airfoil surface, may be used under wet conditions-even under water-and should withstand the harsh environment of a high-lift scenario. A new miniature silicon on insulator (SOI)-based MEMS pressure sensor, which allows integration into airfoils in a flip-chip configuration, is presented. An internal, highly doped silicon wiring with "butterfly" geometry combined with through glass via (TGV) technology enables a watertight and application-suitable chip-scale-package (CSP). The chips were produced by reliable batch microfabrication including femtosecond laser processes at the wafer-level. Sensor characterization demonstrates a high resolution of 38 mVV-1 bar-1. The stepless ultra-smooth and electrically passivated sensor surface can be coated with thin surface protection layers to further enhance robustness against harsh environments. Accordingly, protective coatings of amorphous hydrogenated silicon nitride (a-SiN:H) and amorphous hydrogenated silicon carbide (a-SiC:H) were investigated in experiments simulating environments with high-velocity impacting particles. Topographic damage quantification demonstrates the superior robustness of a-SiC:H coatings and validates their applicability to future sensors.