RESUMO
We propose a novel strategy to integrate the nanoimprint lithography (NIL) technique with directed self-assembly (DSA) of block copolymer (BCP) for providing a robust, high-yield, and low-defect-density path to sub-20 nm dense patterning. Through this new NIL-DSA method, UV nanoimprint resist is used as the DSA copolymer pre-pattern to expedite the DSA process. This method was successfully used to fabricate a 1.0 Td in(-2) servo-integrated nanoimprint template for bit-patterned media (BPM) application. The fabricated template was used for UV-cure NIL on a 2.5-inch disk. The imprint resist patterns were further transferred into the underlying CoCrPt magnetic layer through a carbon hard mask using ion beam etching. The successful integration of the NIL technique with the DSA process provides us with a new route to BPM nanofabrication, which includes the following three major advantages: (1) a simpler and faster way to implement DSA for high-density BPM patterning; (2) a novel method for fabricating a high-quality dot pattern template through an iterative imprint-DSA-template procedure; and (3) an uncomplicated integration scheme for implementing non-periodic servo features with BCP patterns, thus accelerating the transition of moving the DSA technique from laboratory research to the BPM manufacturing environment.
RESUMO
The combination of block copolymer (BCP) lithography and plasma etching offers a gateway to densely packed sub-10 nm features for advanced nanotechnology. Despite the advances in BCP lithography, plasma pattern transfer remains a major challenge. We use controlled and low substrate temperatures during plasma etching of a chromium hard mask and then the underlying substrate as a route to high aspect ratio sub-10 nm silicon features derived from BCP lithography. Siloxane masks were fabricated using poly(styrene-b-siloxane) (PS-PDMS) BCP to create either line-type masks or, with the addition of low molecular weight PS-OH homopolymer, dot-type masks. Temperature control was essential for preventing mask migration and controlling the etched feature's shape. Vertical silicon wire features (15 nm with feature-to-feature spacing of 26 nm) were etched with aspect ratios up to 17 : 1; higher aspect ratios were limited by the collapse of nanoscale silicon structures. Sub-10 nm fin structures were etched with aspect ratios greater than 10 : 1. Transmission electron microscopy images of the wires reveal a crystalline silicon core with an amorphous surface layer, just slightly thicker than a native oxide.