Strain-dependent grain boundary properties of n-type germanium layers.

Polycrystalline Ge thin films have attracted considerable attention as potential materials for use in various electronic and optical devices. We recently developed a low-temperature solid-phase crystallization technology for a doped Ge layer and achieved the highest electron mobility in a polycrystalline Ge thin film. In this study, we investigated the effects of strain on the crystalline and electrical properties of n-type polycrystalline Ge layers. By inserting a GeOx interlayer directly under Ge and selecting substrates with different coefficients of thermal expansion, we modulated the strain in the polycrystalline Ge layer, ranging from approximately 0.6% (tensile) to - 0.8% (compressive). Compressive strain enlarged the grain size to 12 µm, but decreased the electron mobility. The temperature dependence of the electron mobility clarified that changes in the potential barrier height of the grain boundary caused this behavior. Furthermore, we revealed that the behavior of the grain boundary barrier height with respect to strain is opposite for the n- and p-types. This result strongly suggests that this phenomenon is due to the piezoelectric effect. These discoveries will provide guidelines for improving the performance of Ge devices and useful physical knowledge of various polycrystalline semiconductor thin films.

Thickness Dependency of Battery Anode Properties in Multilayer Graphene.

With the development of practical thin-film batteries, multilayer graphene (MLG) is being actively investigated as an anode material. Therefore, research on determining a technique to fabricate thick MLG on arbitrary substrates at low temperatures is essential. In this study, we formed an MLG with controlled thickness at low temperatures using a layer exchange (LE) technique and evaluated its anode properties. The LE technique enabled the formation of a uniform MLG with a wide range of thicknesses (25-500 nm) on Ta foil. The charge/discharge characterization using coin-type cells revealed that the total capacity, which corresponded to Li intercalation into the MLG interlayer, increased with increasing MLG thickness. In contrast, cross-sectional transmission electron microscopy showed a metal oxide formed at the MLG/Ta interface during annealing, which had small Li capacity. MLG with sufficient thickness (500 nm) exhibited an excellent Coulombic efficiency and capacity retention compared to bulk graphite formed at high temperatures. These results have led to the development of inexpensive and reliable rechargeable thin-film batteries.

High Thermoelectric Performance in Polycrystalline GeSiSn Ternary Alloy Thin Films.

Group IV materials are promising candidates for highly reliable and human-friendly thin-film thermoelectric generators, used for micro-energy harvesting. In this study, we investigated the synthesis and thermoelectric applications of a Ge-based ternary alloy thin film, Ge1-x-ySixSny. The solid-phase crystallization of the highly densified amorphous precursors allowed the formation of high-quality polycrystalline Ge1-x-ySixSny layers on an insulating substrate. The small compositions of Si and Sn in Ge1-x-ySixSny (x < 0.15 and y < 0.05) lowered the thermal conductivity (3.1 W m-1 K-1) owing to the alloy scattering of phonons, while maintaining a high carrier mobility (approximately 200 cm2 V-1 s-1). The solid-phase diffusion of Ga and P allowed us to control the carrier concentration to the order of 1019 cm-3 for holes and 1018 cm-3 for electrons. For both p- and n-type Ge1-x-ySixSny, the power factor peaked at x = 0.06 and y = 0.02, reaching 1160 µW m-1 K-2 for p-type and 2040 µW m-1 K-2 for n-type. The resulting dimensionless figure of merits (0.12 for p-type and 0.20 for n-type) are higher than those of most environmentally friendly thermoelectric thin films. These results indicate that group IV alloys are promising candidates for high-performance, reliable thin-film thermoelectric generators.

Acceptor defects in polycrystalline Ge layers evaluated using linear regression analysis.

Polycrystalline Ge thin films have recently attracted renewed attention as a material for various electronic and optical devices. However, the difficulty in the Fermi level control of polycrystalline Ge films owing to their high density of defect-induced acceptors has limited their application in the aforementioned devices. Here, we experimentally estimated the origin of acceptor defects by significantly modulating the crystallinity and electrical properties of polycrystalline Ge layers and investigating their correlation. Our proposed linear regression analysis method, which is based on deriving the acceptor levels and their densities from the temperature dependence of the hole concentration, revealed the presence of two different acceptor levels. A systematic analysis of the effects of grain size and post annealing on the hole concentration suggests that deep acceptor levels (53-103 meV) could be attributed to dangling bonds located at grain boundaries, whereas shallow acceptor levels (< 15 meV) could be attributed to vacancies in grains. Thus, this study proposed a machine learning-based simulation method that can be widely applied in the analysis of physical properties, and can provide insights into the understanding and control of acceptor defects in polycrystalline Ge thin films.