Large-scale, heterogeneous integration of nanowire arrays for image sensor circuitry.

We report large-scale integration of nanowires for heterogeneous, multifunctional circuitry that utilizes both the sensory and electronic functionalities of single crystalline nanomaterials. Highly ordered and parallel arrays of optically active CdSe nanowires and high-mobility Ge/Si nanowires are deterministically positioned on substrates, and configured as photodiodes and transistors, respectively. The nanowire sensors and electronic devices are then interfaced to enable an all-nanowire circuitry with on-chip integration, capable of detecting and amplifying an optical signal with high sensitivity and precision. Notably, the process is highly reproducible and scalable with a yield of approximately 80% functional circuits, therefore, enabling the fabrication of large arrays (i.e., 13 x 20) of nanowire photosensor circuitry with image-sensing functionality. The ability to interface nanowire sensors with integrated electronics on large scales and with high uniformity presents an important advance toward the integration of nanomaterials for sensor applications.

Wafer-scale assembly of highly ordered semiconductor nanowire arrays by contact printing.

Controlled and uniform assembly of "bottom-up" nanowire (NW) materials with high scalability presents one of the significant bottleneck challenges facing the integration of nanowires for electronic applications. Here, we demonstrate wafer-scale assembly of highly ordered, dense, and regular arrays of NWs with high uniformity and reproducibility through a simple contact printing process. The assembled NW pitch is shown to be readily modulated through the surface chemical treatment of the receiver substrate, with the highest density approaching approximately 8 NW/mum, approximately 95% directional alignment, and wafer-scale uniformity. Such fine control in the assembly is attained by applying a lubricant during the contact printing process which significantly minimizes the NW-NW mechanical interactions, therefore enabling well-controlled transfer of nanowires through surface chemical binding interactions. Furthermore, we demonstrate that our printing approach enables large-scale integration of NW arrays for various device structures on both rigid silicon and flexible plastic substrates, with a controlled semiconductor channel width ranging from a single NW ( approximately 10 nm) up to approximately 250 microm, consisting of a parallel array of over 1250 NWs and delivering over 1 mA of ON current.

Controlled nanoscale doping of semiconductors via molecular monolayers.

One of the major challenges towards scaling electronic devices to the nanometre-size regime is attaining controlled doping of semiconductor materials with atomic accuracy, as at such small scales, the various existing technologies suffer from a number of setbacks. Here, we present a novel strategy for controlled, nanoscale doping of semiconductor materials by taking advantage of the crystalline nature of silicon and its rich, self-limiting surface reaction properties. Our method relies on the formation of a highly uniform and covalently bonded monolayer of dopant-containing molecules, which enables deterministic positioning of dopant atoms on the Si surfaces. In a subsequent annealing step, the dopant atoms are diffused into the Si lattice to attain the desired doping profile. We show the versatility of our approach through controlled p- and n-doping of a wide range of semiconductor materials, including ultrathin silicon-on-insulator substrates and nanowires, which are then configured into novel transistor structures.

Formation and characterization of NixInAs/InAs nanowire heterostructures by solid source reaction.

The formation of crystalline NixInAs and NixInAs/InAs/NixInAs heterostructure nanowires by the solid source reaction of InAs nanowires with Ni is reported for the first time. The fundamental kinetics of the Ni/InAs alloying reaction is explored, with the Ni diffusion reported as the rate determining step. The diffusivity of Ni is independent of the nanowire diameter, with an extracted diffusion activation energy of approximately 1 eV/atom. The metallic NixInAs exhibits a modest resistivity of approximately 167 micro omega x cm for diameters >30 nm, with the resistivity increasing as the nanowire diameter is further reduced due to the enhanced surface scattering. The alloying reaction readily enables the fabrication of NixInAs/InAs/NixInAs heterostructure nanowire transistors for which the length of the InAs segment (i.e., channel length) is controllably reduced through subsequent thermal annealing steps, therefore enabling a systematic study of electrical properties as a function of channel length. From the electrical transport studies, an electron mean free path on the order of a few hundred nm is observed for InAs NWs with a unit length normalized, ON-state resistance of approximately 7.5 k omega/microm. This approach presents a route toward the fabrication for high performance InAs nanowire transistors with ohmic nanoscale contacts and low parasitic capacitances and resistances.

Generic nanomaterial positioning by carrier and stationary phase design.

A generic approach for deploying various types of synthetic nanomaterials, including single-walled carbon nanotubes and nanoparticles, at well-defined locations on substrates is presented. The assembly is achieved through the complementary design of the stationary and carrier phases and utilizes the dewetting process during which polymer-encapsulated nanomaterials are delivered and positioned on predefined locations of substrates. Covalent modification of the nano-objects is not required for the building block positioning, therefore, preserving their intrinsic chemical and physical properties. The potency of this new approach is demonstrated for various synthetic nanomaterials, such as polystyrene, silica, and gold nanoparticles as well as single-walled carbon nanotubes, showing highly specific and direct patterning of cm2 areas using a generic assembly strategy.