Synergetic enhancement of thermoelectric performances by localized carrier and phonon scattering in Cu2Se with incorporated fullerene nanoparticles.

C60/Cu2Se thermoelectric nanocomposites were synthesized with various amounts of fullerene (C60; 0.03, 0.3, 0.5, 0.7 mol%) incorporated in Cu2Se. The thermoelectric figures of merits (zT) of the C60/Cu2Se nanocomposites were enhanced by 20-30% compared to that of pure Cu2Se, reaching a value of 1.4 at 773 K. The primary cause of zT enhancement is the synergetic effect of thermal conductivity reduction by phonon scattering and Seebeck coefficient increase by carrier localization that results from incorporation of C60 nanoparticles. Theoretical calculations for Seebeck coefficient enhancement and lattice thermal conductivity reduction were performed. The Seebeck coefficients of C60/Cu2Se nanocomposites were around 43% higher than that of pure Cu2Se, whereas the reduction of lattice thermal conductivity with incorporation of C60 was around 40-50%.

Size-Controlled Au-Cu2Se Core-Shell Nanoparticles and Their Thermoelectric Properties.

One promising approach to improving thermoelectric energy conversion is to use nanostructured interfaces that enhance Seebeck coefficient while reducing thermal conductivity. Here, we synthesized Au-Cu2Se core-shell nanoparticles with different shell thicknesses by controlling the precursor concentration in solution. The Au-Cu2Se core-shell nanoparticles are about 37-53 nm in size, and the cores of the nanostructures are composed of Au nanoparticles with sizes of ∼11 nm. The effect of shell thickness on the thermoelectric properties of core-shell nanocomposites is investigated after sintering the core-shell nanoparticles into pellets using the spark plasma sintering (SPS) technique. The power factor was optimized by the synergetic effect of the improvement of Seebeck coefficient by energy filtering in the Au/Cu2Se interface and the effective tuning of carrier concentration by Ohmic contact in the interface. The lattice thermal conductivity of core-shell nanocomposites is reduced by coherent phonon scattering, which is caused by the wavelike interference of phonons due to the phase shift in the core-shell interface. The highest ZT value of 0.61 is obtained at 723 K for Au-Cu2Se core-shell nanocomposite with a shell thickness of 21 nm, which is higher than that of pure Cu2Se nanocomposite or a mixture of Au and Cu2Se particles.

Gigantic Phonon-Scattering Cross Section To Enhance Thermoelectric Performance in Bulk Crystals.

In thermoelectric energy conversions, thermal conductivity reduction is essential for enhancing thermoelectric performance while maintaining a high power factor. Herein, we propose an approach based on coated-grain structures to effectively reduce the thermal conductivity to a much greater degree when compared to that done by conventional nanodot nanocomposite. By incorporating CdTe coated layers on the surface of SnTe grains, the thermal conductivity is as low as 1.16 W/m-K at 929 K, resulting in a thermoelectric figure of merit, i.e., zT, of 1.90. According to our developed theory, phonons scatter coherently due to the phase lag between phonons passing through and around the coated grain. Such scattering is induced by the acoustic impedance mismatch between the coated layer and the grain, resulting in a gigantic phonon-scattering cross section. The phonon-scattering cross section of the coated grains is several orders of magnitude larger than that of the nanodots with the same impurity concentration. The power factor was also slightly increased by the energy filtering effect at the coated surface and additional minority carrier blocking by the heterointerfaces. This scheme can be utilized for various bulk crystals, meaning a broad range of materials can be considered for thermoelectric applications.

Thermoelectric Properties of Bi2Te3: CuI and the Effect of Its Doping with Pb Atoms.

In order to understand the effect of Pb-CuI co-doping on the thermoelectric performance of Bi2Te3, n-type Bi2Te3 co-doped with x at % CuI and 1/2x at % Pb (x = 0, 0.01, 0.03, 0.05, 0.07, and 0.10) were prepared via high temperature solid state reaction and consolidated using spark plasma sintering. Electron and thermal transport properties, i.e., electrical conductivity, carrier concentration, Hall mobility, Seebeck coefficient, and thermal conductivity, of CuI-Pb co-doped Bi2Te3 were measured in the temperature range from 300 K to 523 K, and compared to corresponding x% of CuI-doped Bi2Te3 and undoped Bi2Te3. The addition of a small amount of Pb significantly decreased the carrier concentration, which could be attributed to the holes from Pb atoms, thus the CuI-Pb co-doped samples show a lower electrical conductivity and a higher Seebeck coefficient when compared to CuI-doped samples with similar x values. The incorporation of Pb into CuI-doped Bi2Te3 rarely changed the power factor because of the trade-off relationship between the electrical conductivity and the Seebeck coefficient. The total thermal conductivity(κtot) of co-doped samples (κtot ~ 1.4 W/m∙K at 300 K) is slightly lower than that of 1% CuI-doped Bi2Te3 (κtot ~ 1.5 W/m∙K at 300 K) and undoped Bi2Te3 (κtot ~ 1.6 W/m∙K at 300 K) due to the alloy scattering. The 1% CuI-Pb co-doped Bi2Te3 sample shows the highest ZT value of 0.96 at 370 K. All data on electrical and thermal transport properties suggest that the thermoelectric properties of Bi2Te3 and its operating temperature can be controlled by co-doping.