High temperature characteristics and solidification microstructures of dental metallic materials. Part III alloys for metal-bond porcelain.

The thermal expansion rate, coefficient of thermal expansion, and high temperature strength of two types of commercially available alloy for metal-bond porcelain, KIK-HII (KIK) and Degubond-J2 (J2), were evaluated up to the liquidus point temperature using a thermo-mechanical analyzer. Furthermore, microstructure in the solid-liquid coexisting region was observed for evaluation. Our results revealed the following findings: 1. For KIK, solidus point was 1,209.3 +/- 3.2 degrees C, liquidus point was 1,308.3 +/- 7.10 degrees C, and melting expansion rate was 0.41+/- 0.16%. 2. For J2, solidus point was 1,198.3 +/- 0.6 degrees C, liquidus point was 1,253.0 +/- 4.4 degrees C, and melting expansion rate was 4.50 +/- 0.80%. 3. At high temperature, the mechanical characteristics of KIK greatly differed from those of J2. The risk of causing deformation during porcelain baking was suggested for KIK. Removal of segregation during casting was considered difficult in J2.

High temperature characteristics and solidification microstructures of dental metallic materials. Part II. ADAS Type 3 gold alloy.

Previously, high temperature properties of the silver-palladium-copper-gold alloy were investigated. In this study, the thermal expansion percentage and coefficient, and high temperature strengths of ADAS Type 3 gold alloy were investigated up to the liquidus temperature. Furthermore, microstructural and compositional changes in the solid/liquid dual phase were studied. The following conclusions were obtained. (1) The solidus point of the Type 3 gold alloy was 899.3+/-11.7 degrees C, and the liquidus point was 962.3+/-2.4 degrees C. (2) The thermal expansion percentage at the solidus point was 1.636+/-0.046%, while it was 4.853+/-0.213% for the liquidus point. The thermal expansion percentage of the melt was 3.217+/-0.257%. (3) The melt expansion was observed even under the measuring pressure of 373.75 HPa, which was quite different from the fact that the melt expansion disappeared at the pressure of 20.87 HPa for the silver-palladium-copper-gold alloy. (4) The morphology of solid phase in the solid/liquid dual zone of this alloy was quite different from those observed with the silver-palladium-copper-gold alloy.