Ink-jet printing of cu-ag-based highly conductive tracks on a transparent substrate.

We have developed a Cu-Ag-based mixed metal conductive ink from which highly conductive tracks form on a flexible substrate after annealing at low temperature. Addition of small Ag particles significantly improves the particle packing density by filling the interstices formed between the larger Cu particles, which in turn facilitates better conductivity compared to pure Cu metal film. The particle size and volume ratio of the Ag particles added should be carefully controlled to achieve maximum packing density in the bimodal particle system, which is consistent with the theoretical considerations of the Furnas model. In addition, we demonstrate direct writing of complex patterns that exhibit high conductivity upon annealing at sufficiently low temperature (175-210 degrees C) to not damage the transparent plastic substrate such as polyethersulphone (PES).

Synthesis and size control of monodisperse copper nanoparticles by polyol method.

We describe herein the synthesis of metallic copper nanoparticles in the presence of poly(vinylpyrrolidone), employed as a protecting agent, via a polyol method in ambient atmosphere. The obtained copper particles were confirmed by XRD to be crystalline copper with a face-centered cubic (fcc) structure. We observed monodisperse spherical copper nanoparticles with a diameter range 45+/-8 nm. The particle size and its distribution are controlled by varying the synthesis parameters such as the reducing agent concentration, reaction temperature, and precursor injection rate. The precursor injection rate plays an important role in controlling the size of the copper nanoparticles. On the basis of XPS and HRTEM results, we demonstrate that the surface of the copper is surrounded by amorphous CuO and that poly(vinylpyrrolidone) is chemisorbed on the copper surface.

Insertion of Imines into Palladium-Acyl Bonds: Towards Metal-Catalyzed Alternating Copolymerization of Imines with Carbon Monoxide To Form Polypeptides.

From a methyl ligand, CO, and an imine a chelating amide ligand is formed by insertion of the C=N bond into the metal-acyl bond in cationic palladium(II) complexes (see reaction below). The cationic acylpalladium complexes are obtained from CO and readily accessible palladium starting materials. LL=diphosphane ligand.