Deep-level defects induced by implantations of Si and Mg ions into undoped epitaxial GaN.

The properties and concentrations of deep-level defects induced by implantations of Si and Mg ions into unintentionally doped (UID) epitaxial GaN have been revealed by using the Laplace-transform photoinduced transient spectroscopy (LPITS) and molecular dynamics (MD) calculations. The material lattice damage, produced by the Si ions implanted at room temperature in the single process at the energies of 200 and 340 keV, is compared with that produced by the Mg ions implanted in the similar process at the energies of 150, 210, and 270 keV. The LPITS results indicate that the same deep traps with the activation energies of 396, 512, 531, 587, 635, and 736 meV are present in the tail regions of the semi-insulating Si- and Mg-implanted films. It is argued that the predominant implantation-induced point defects in the tail region of the Si-implanted films are nitrogen vacancies, whose concentration is 7.7 × 1017 cm-3. In the Mg-implanted films, the predominant implantation-induced point defects are gallium interstitials, whose concentration is 1.2 × 1 018 cm-3.

Formation of Grown-In Nitrogen Vacancies and Interstitials in Highly Mg-Doped Ammonothermal GaN.

The formation of intrinsic point defects in the N-sublattice of semi-insulating Mg-doped GaN crystals grown by the ammonothermal method (SI AT GaN:Mg) was investigated for the first time. The grown-in defects produced by the displacement of nitrogen atoms were experimentally observed as deep traps revealed by the Laplace transform photoinduced transient spectroscopy in the compensated p-type crystals with the Mg concentrations of 6 × 1018 and 2 × 1019 cm-3 and resistivities of ~1011 Ωcm and ~106 Ωcm, respectively. In both kinds of materials, three closely located traps with activation energies of 430, 450, and 460 meV were revealed. The traps, whose concentrations in the stronger-doped material were found to be significantly higher, are assigned to the (3+/+) and (2+/+) transition levels of nitrogen vacancies as well as to the (2+/+) level of nitrogen split interstitials, respectively. In the material with the lower Mg concentration, a middle-gap trap with the activation energy of 1870 meV was found to be predominant. The results are confirmed and quantitatively described by temperature-dependent Hall effect measurements. The mechanism of nitrogen atom displacement due to the local strain field arising in SI AT GaN:Mg is proposed and the effect of the Mg concentration on the charge compensation is discussed.