Realization of Long-Life Proton Battery by Layer Intercalatable Electrolyte.

Proton batteries have attracted increasing interests because of their potential for grid-scale energy storage with high safety and great low-temperature performances. However, their development is significantly retarded by electrolyte design due to free water corrosion. Herein, we report a layer intercalatable electrolyte (LIE) by introducing trimethyl phosphate (TMP) into traditional acidic electrolyte. Different from conventional role in batteries, the presence of TMP intriguingly achieves co-intercalation of solvent molecules into the interlayer of anode materials, enabling a new working mechanism for proton reactions. The electrode corrosion was also strongly retarded with expanded electrochemical stability window. The half-cell therefore showed an outstanding long-term cycling stability with 91.0% capacity retention at 5 A g-1 after 5000 cycles. Furthermore, the assembled full batteries can even deliver an ultra-long lifetime with a capacity retention of 74.9% for 2 months running at -20 °C. This work provides new opportunities for electrolyte design of aqueous batteries.

Green synthesis of novelin situmicro/submicron-Cu paste for semiconductor interconnection.

A green method for the synthesis ofin situCu paste is developed. Cu particles are prepared through chemical reduction by selecting a special copper source, reducing agent, and solvent. Then the reaction solution is directly concentrated to obtain anin situCu paste. The synthesis of Cu particles and the preparation of Cu paste are conducted simultaneously, and the process of separation, purification, drying, storage, and re-dispersion of powder are reduced. Particles are not directly exposed to air, thus the oxidation of micro/submicron -Cu is effectively prevented, and the agglomeration of particles caused by drying and dispersion operations is simultaneously reduced. Furthermore, the proposed method has a certain universality, and different types of Cu sources can be used to preparein situpaste with different sizes and morphologies. The entire preparation process is simple, efficient, green, and the yield can reach 99.99%, which breaks through the bottleneck of the application of traditional micro/submicron-Cu materials. Copper acetate-basedin situpaste is sintered for 30 min at 260 °C and 2 MPa in a reducing atmosphere. The shear strength, resistivity, and thermal conductivity reach 55.26 MPa, 4.01 × 10-8Ω·m, and 92.75 W/(m·K), respectively, which could meet the interconnection application of power semiconductor devices.