3D Printing of Composite Radiation Shielding for Broad Spectrum Protection of Electronic Systems.

The miniaturization of satellite systems has compounded the need to protect microelectronic components from damaging radiation. Current approaches to mitigate this damage, such as indiscriminate mass shielding, built-in redundancies, and radiation-hardened electronics, introduce high size, weight, power, and cost penalties that impact the overall performance of the satellite or launch opportunities. Additive manufacturing provides an appealing strategy to deposit radiation shielding only on susceptible components within an electronic assembly. Here, a versatile material platform and process to conformally print customized composite inks at room temperature directly and selectively onto commercial-off-the-shelf electronics is described. The suite of inks uses a flexible styrene-isoprene-styrene block copolymer binder that can be filled with particles of different atomic densities for diverging radiation shielding capabilities. Additionally, the system enables the combination of multiple distinct particle species within the same printed structure. The method can produce graded shielding that offers improved radiation attenuation by tailoring both shield geometry and composition to provide comprehensive protection from a broad range of radiation species. The authors anticipate this alternative to traditional shielding methods will enable the rapid proliferation of the next generation of compact satellite designs.

Additive Manufacturing of Multimaterial Composites for Radiation Shielding and Thermal Management.

The harsh radiation environment of space induces the degradation and malfunctioning of electronic systems. Current approaches for protecting these microelectronic devices are generally limited to attenuating a single type of radiation or require only selecting components that have undergone the intensive and expensive process to be radiation-hardened by design. Herein, we describe an alternative fabrication strategy to manufacture multimaterial radiation shielding via direct ink writing of custom tungsten and boron nitride composites. The additively manufactured shields were shown to be capable of attenuating multiple species of radiation by tailoring the composition and architecture of the printed composite materials. The shear-induced alignment during the printing process of the anisotropic boron nitride flakes provided a facile method for introducing favorable thermal management characteristics to the shields. This generalized method offers a promising approach for protecting commercially available microelectronic systems from radiation damage and we anticipate this will vastly enhance the capabilities of future satellites and space systems.