Kirigami-Origami-Inspired Lead-Free Piezoelectric Ceramics.

Kirigami- and oirigami-inspired techniques have emerged as effective strategies for material structure design; however, the use of these techniques is usually limited to soft and deformable materials. Piezoelectric ceramics, which are typical functional ceramics, are widely used in electronic and energy devices; however, the processing options for piezoelectric ceramics are limited by their brittleness and feedstock viscosity. Here, a design strategy is proposed for the preparation of lead-free piezoelectric ceramics inspired by kirigami/origami. This strategy involves direct writing printing and control over the external gravity during the calcination process for the preparation of curved and porous piezoelectric ceramics with specific shapes. The sintered BaTiO3 ceramics with curved geometries produced using this strategy exhibit a high piezoelectric constant (d33 = 275 pC N-1 ), which is 45% higher than that of conventionally sintered sheet ceramics. The curved structure of the ceramics is well-suited for use in the human body and it was determined that these curved ceramics can detect pulse signals. This strategy can be applied in the large-scale and low-cost production of other piezoelectric ceramics with various curved shapes and provides a new approach for the preparation of complex-shaped ceramics.

Influence of Oxidation Damages on Mechanical Properties of SiC/SiC Composite Using Domestic Hi-Nicalon Type SiC Fibers.

Here, we show that when the oxidation treatment temperature exceeded 600°C, the tensile strength of SiC/SiC begins to decrease. Oxidation leads to the damages on the PyC fiber/matrix interface, which is replaced by SiO2 at higher temperature. The fracture mode converts from fiber pull-out to fiber-break as the fiber/matrix interface is filled with SiO2. Oxidation time also plays an important role in affecting the tensile strength of SiC/SiC. The tensile modulus decreases with temperature from RT to 800°C, then increases above 800°C due to the decomposition of remaining CSi x O y and crystallization of the SiC matrix. A special surface densification treatment performed in this study is confirmed to be an effective approach to reduce the oxidation damages and improve the tensile strength of SiC/SiC after oxidation.

Mechanical Properties and Failure Behavior of 3D-SiCf/SiC Composites with Different Interphases.

Continuous silicon carbide fiber-reinforced silicon carbide ceramic matrix composites (SiCf/SiC) are promising as thermal structural materials. In this work, the microstructure and static mechanical properties of 3D-SiCf/SiC with PyC, SiC, and PyC/SiC and without an interface prepared via polymer infiltration and pyrolysis (PIP) were investigated systematically in this paper. The results show that the microstructure and static mechanical properties of SiCf/SiC with an interphase layer were superior to the composites without an interlayer, and the interface debondings are existing in the composite without an interphase, resulting in a weak interface bonding. When the interphase is introduced, the interfacial shear strength is improved, the crack can be deflected, and the fracture energy can be absorbed. Meanwhile, the shear strength of the composites with PyC and PyC/SiC interfaces was 118 MPa and 124 MPa, respectively, and showing little difference in bending properties. This indicates that the sublayer SiC of the PyC/SiC multilayer interface limits the binding state and the plastic deformation of PyC interphase, and it is helpful to improve the mechanical properties of SiCf/SiC.

Carbon Fiber Reinforced Carbon-Al-Cu Composite for Friction Material.

A carbon/carbon-Al-Cu composite reinforced with carbon fiber 2.5D-polyacrylonitrile-based preforms was fabricated using the pressureless infiltration technique. The Al-Cu alloy liquids were successfully infiltrated into the C/C composites at high temperature and under vacuum. The mechanical and metallographic properties, scanning electron microscopy (SEM), X-ray diffraction (XRD), and energy dispersive spectroscopy (EDS) of the C/C-Al-Cu composites were analyzed. The results showed that the bending property of the C/C-Al-Cu composites was 189 MPa, whereas that of the pure carbon slide material was only 85 MPa. The compressive strength of C/C-Al-Cu was 213 MPa, whereas that of the pure carbon slide material was only 102 MPa. The resistivity of C/C-Al-Cu was only 1.94 µΩm, which was lower than that of the pure carbon slide material (29.5 µΩm). This finding can be attributed to the "network conduction" structure. Excellent wettability was observed between Al and the carbon matrix at high temperature due to the existence of Al4C3. The friction coefficients of the C/C, C/C-Al-Cu, and pure carbon slide composites were 0.152, 0.175, and 0.121, respectively. The wear rate of the C/C-Al-Cu composites reached a minimum value of 2.56 × 10-7 mm³/Nm. The C/C-Al-Cu composite can be appropriately used as railway current collectors for locomotives.

Effect of the Nitrogen Incorporation on the Microstructure and Photoelectric Properties of N Type Nanocrystalline Silicon Thin Films.

N type silicon-rich nanocrystalline-SiN(x) ∶ H films were prepared by plasma enhanced chemical vapor deposition technique by changing NH3 flow rate. The effect of nitrogen incorporation on the microstructure and photoelectric properties of the thin films were characterized by Raman, Fourier transform infrared spectroscopy, ultraviolet-visible absorption spectra, and Hall effect measurement. The results indicated that with the increasing NH3, a phase transition from microcrystalline to amorphous silicon occured. Transmission electron microscope observation revealed that the size of silicon quantum dots could be adjusted by varying the flow rate of NH3. The microstructure order of the films reduced with increasing the flow rate of NH3, while the optical band gap increased, and the optical band tail became narrow. Meanwhile, Si­N bonds density increased and P doping was blocked. I-V testing results showed that with increasing NH3, the conductivity of films first decreased compared with nanocrystalline-Si and then increased. These behaviors reveal a competition in the mechanisms controlling the conductivity. However, with further increasing NH3, the conductivity decreased significantly due to rapid carrier recombination on the amorphous net structure.