A tungsten external heater for BX90 diamond anvil cells with a range up to 1700 K.

Resistive heating of a sample in a diamond anvil cell (DAC) can generate a homogeneous temperature field across the sample chamber with reliable temperatures measured by a thermocouple. It is of importance in experiments aiming at exploring phase diagrams and quantifying thermoelastic properties of materials. Here, we present a ring-heater design developed for BX90 diamond anvil cells (DACs). It is made of a ring-shaped aluminum oxide holder hosting a tungsten wire coil inside and coupled with Ar + 2% H2 gas to prevent oxidation during experiment. This modular plug-and-play design enables in situ studies of samples via x-ray diffraction up to a temperature of 1700 K. Temperature in the BX90 sample volume as measured through a thermocouple was calibrated using the melting point of gold. As an application of this design, we report the thermal expansion coefficient of MgO at 9.5(1) GPa.

Hartmann characterization of the PEEM-3 aberration-corrected X-ray photoemission electron microscope.

Aberration correction by an electron mirror dramatically improves the spatial resolution and transmission of photoemission electron microscopes. We will review the performance of the recently installed aberration corrector of the X-ray Photoemission Electron Microscope PEEM-3 and show a large improvement in the efficiency of the electron optics. Hartmann testing is introduced as a quantitative method to measure the geometrical aberrations of a cathode lens electron microscope. We find that aberration correction leads to an order of magnitude reduction of the spherical aberrations, suggesting that a spatial resolution of below 100 nm is possible at 100% transmission of the optics when using x-rays. We demonstrate this improved performance by imaging test patterns employing element and magnetic contrast.

Coded aperture imaging for fluorescent x-rays.

We employ a coded aperture pattern in front of a pixilated charge couple device detector to image fluorescent x-rays (6-25 KeV) from samples irradiated with synchrotron radiation. Coded apertures encode the angular direction of x-rays, and given a known source plane, allow for a large numerical aperture x-ray imaging system. The algorithm to develop and fabricate the free standing No-Two-Holes-Touching aperture pattern was developed. The algorithms to reconstruct the x-ray image from the recorded encoded pattern were developed by means of a ray tracing technique and confirmed by experiments on standard samples.

Shear at twin domain boundaries in YBa2Cu3O7-x.

The microstructure and strain state of twin domains in YBa2Cu3O7-x are discussed based upon synchrotron white-beam x-ray microdiffraction measurements. Intensity variations of the fourfold twin splitting of Laue diffraction peaks are used to determine the twin domain structure. Strain analysis shows that interfaces between neighboring twin domains are strained in shear, whereas the interior of these domains are regions of low strain. These measurements are consistent with the orientation relationships of twin boundaries within and across domains and show that basal plane shear stresses can exceed 100 MPa where twin domains meet. Our results support stress field pinning of magnetic flux vortices by twin domain boundaries.

Local plasticity of Al thin films as revealed by x-ray microdiffraction.

Grain-to-grain interactions dominate the plasticity of Al thin films and establish effective length scales smaller than the grain size. We have measured large strain distributions and their changes under plastic strain in 1.5-microm-thick Al 0.5% Cu films using a 0.8-microm-diameter white x-ray probe at the Advanced Light Source. Strain distributions arise not only from the distribution of grain sizes and orientation, but also from the differences in grain shape and from stress environment. Multiple active glide plane domains have been found within single grains. Large grains behave like multiple smaller grains even before a dislocation substructure can evolve.

Scanning X-ray microdiffraction with submicrometer white beam for strain/stress and orientation mapping in thin films.

Scanning X-ray microdiffraction (microSXRD) combines the use of high-brilliance synchrotron sources with the latest achromatic X-ray focusing optics and fast large-area two-dimensional-detector technology. Using white beams or a combination of white and monochromatic beams, this technique allows for the orientation and strain/stress mapping of polycrystalline thin films with submicrometer spatial resolution. The technique is described in detail as applied to the study of thin aluminium and copper blanket films and lines following electromigration testing and/or thermal cycling experiments. It is shown that there are significant orientation and strain/stress variations between grains and inside individual grains. A polycrystalline film when investigated at the granular (micrometer) level shows a highly mechanically inhomogeneous medium that allows insight into its mesoscopic properties. If the microSXRD data are averaged over a macroscopic range, results show good agreement with direct macroscopic texture and stress measurements.

Synchrotron radiation sources and condensers for projection x-ray lithography.

The design requirements for a compact electron storage ring that could be used as a soft-x-ray source for projection lithography are discussed. The design concepts of the x-ray optics that are required for collecting and conditioning the radiation in divergence, uniformity, and direction to illuminate the mask correctly and the particular x-ray projection camera used are discussed. Preliminary designs for an entire soft-x-ray projection lithography system that uses an electron storage ring as a soft-x-ray source are presented. It is shown that, by combining the existing technology of storage rings with large collection angle condensers, a powerful and reliable source of 130-A photons for production line projection x-ray lithography is possible.

Mask technologies for soft-x-ray projection lithography at 13 nm.

We describe a variety of technologies for patterning transmissive and reflective soft x-ray projectionlithography masks containing features as small as 0.1 µm. The transmission masks fabricated for use at 13 nm are of one type, a Ge-absorbing layer patterned on a boron-doped Si membrane. Reflective masks were patterned by various methods that included absorbing layers formed on top of multilayer reflectors, multilayer-reflector-coating removal by reactive ion etching, and ion damage of multilayer regions by ion implantation. For the first time, we believe, a process for absorber repair that does not significantly damage the reflectance of the multilayer coating on the reflection mask is demonstrated.

Characterization of AZ PN114 resist for soft-x-ray projection lithography.

Using 14-nm wavelength illumination, we have imaged 0.1-µm-wide lines and spaces in single-layer thin films of the highy sensitive, negative, chemically amplified resist AZ PN114 by usingboth a Schwarzschild 20× camera and an Offner ring field 1× optical system. For soft-x-ray projection lithography the approximate 0.2-µm absorption length in resists at 14-nm wavelength necessitates a multilayer resist system. To explore further the requirements of the imaging layer of such a system, we have transferred patterns, exposed by a high-resolution electron beam in a 60-nm-thick layer of AZ PN114, into the underlying layers of a trilevel structure. Significant pattern edge noise and resist granularity were found. It remains to be determined whether the observed noise is dominated by statistical fluctuations in dose or by resist chemistry. We also investigated pinhole densities in these films and found them to increase from 0.2 cm(-2) for 380-mm-thick films to 15 cm(-2) for 50-nm-thick films.

Soft-x-ray projection lithography experiments using Schwarzschild imaging optics.

Soft-x-ray projection imaging is demonstrated by the use of 14-nm radiation from a laser plasma source and a single-surface multilayer-coated ellipsoidal condenser. Aberrations in the condenser and the Schwarzschild imaging objective are characterized and correlated with imaging performance. A new Schwarzschild housing, designed for improved alignment stability, is described.

Soft-x-ray projection imaging with a 1:1 ring-field optic.

A molybdenum/silicon multilayer-coated 1:1 ring-field optic with a numerical aperture of 0.0835 is used to carry out soft-x-ray projection imaging with undulator radiation at 12.9 nm. An ideal optic of this type should be able to image 0.1-µm features with a contrast exceeding 90% at this wavelength. The useful resolution of our ring-field optic is experimentally found to be approximately 0.2 µm, probably because of the presence of substrate figuring errors.

Diffraction-limited soft-x-ray projection imaging using a laser plasma source.

Projection imaging of 0.1-microm lines and spaces is demonstrated with a Mo/Si multilayer coated Schwarzschild objective and 14-nm illumination from a laser plasma source. This structure has been etched into a silicon wafer by using a trilevel resist and reactive ion etching. Low-contrast modulation at 0.05-microm lines and spaces is observed in polymethylmethacrylate.

Soft-x-ray projection lithography: printing of 0.2-microm features using a 20:1 reduction.

We demonstrate nearly diffraction-limited printing of 0.2-microm features, using soft x rays of approximately 36-nm wavelength. An open-stencil transmission mask with minimum features of 4 microm was imaged by a twentyfold-reduction Schwarzschild-type objective onto silicon wafers coated with various e-beam resists. Implications for soft-x-ray projection lithography are discussed.