Terahertz and Infrared Plasmon Polaritons in PtTe2 Type-II Dirac Topological Semimetal.

Surface plasmon polaritons (SPPs) are electromagnetic excitations existing at the interface between a metal and a dielectric. SPPs provide a promising path in nanophotonic devices for light manipulation at the micro and nanoscale with applications in optoelectronics, biomedicine, and energy harvesting. Recently, SPPs are extended to unconventional materials like graphene, transparent oxides, superconductors, and topological systems characterized by linearly dispersive electronic bands. In this respect, 3D Dirac and Weyl semimetals offer a promising frontier for infrared (IR) and terahertz (THz) radiation tuning by topologically-protected SPPs. In this work, the THz-IR optical response of platinum ditelluride (PtTe2) type-II Dirac topological semimetal films grown on Si substrates is investigated. SPPs generated on microscale ribbon arrays of PtTe2 are detected in the far-field limit, finding an excellent agreement among measurements, theoretical models, and electromagnetic simulation data. The far-field measurements are further supported by near-field IR data which indicate a strong electric field enhancement due to the SPP excitation near the ribbon edges. The present findings indicate that the PtTe2 ribbon array appears an ideal active layout for geometrically tunable SPPs thus inspiring a new fashion of optically tunable materials in the technologically demanding THz and IR spectrum.

All-around encapsulation of silicene.

Silicene or the two-dimensional (2D) graphene-like silicon allotrope has recently emerged as a promising candidate for various applications in nanotechnology. However, concerns on the silicene stability still persist to date and need to be addressed aiming at the fabrication of competing and durable silicene-based devices. Here, we present an all-around encapsulation methodology beyond the current state-of-the-art silicene configuration, namely silicene sandwiched in between a capping layer (e.g., Al2O3) and the supporting substrate (e.g., Ag). In this framework, the insertion of one or two sacrificial 2D Sn layers enables the realization of different atomically thin encapsulation schemes, preserving the pristine properties of silicene while decoupling it from the growth template. On one hand, the epitaxy of a 2D Sn layer before silicene allows for the removal of the Ag substrate with no effect on silicene which in turn can be easily gated, for example, with an oxide layer on its top face. On the other hand, a full 2D encapsulation scheme, where top and bottom faces of silicene are protected by 2D Sn layers, gives rise to an atomically thin and cm2-scaled membrane preventing degradation of silicene for months. Both schemes thus constitute an advancement for the silicene stability and encapsulation in ambient conditions, paving the way to further exploitation in flexible electronics and photonics.

Bendable Silicene Membranes.

Due to their superior mechanical properties, 2D materials have gained interest as active layers in flexible devices co-integrating electronic, photonic, and straintronic functions altogether. To this end, 2D bendable membranes compatible with the technological process standards and endowed with large-scale uniformity are highly desired. Here, it is reported on the realization of bendable membranes based on silicene layers (the 2D form of silicon) by means of a process in which the layers are fully detached from the native substrate and transferred onto arbitrary flexible substrates. The application of macroscopic mechanical deformations induces a strain-responsive behavior in the Raman spectrum of silicene. It is also shown that the membranes under elastic tension relaxation are prone to form microscale wrinkles displaying a local generation of strain in the silicene layer consistent with that observed under macroscopic mechanical deformation. Optothermal Raman spectroscopy measurements reveal a curvature-dependent heat dispersion in silicene wrinkles. Finally, as compelling evidence of the technological potential of the silicene membranes, it is demonstrated that they can be readily introduced into a lithographic process flow resulting in the definition of flexible device-ready architectures, a piezoresistor, and thus paving the way to a viable advance in a fully silicon-compatible technology framework.