Geometrically driven aggregation of unsymmetrical dielectric particles.

Understanding electrostatic interactions among dielectric bodies in the atmosphere and aerosols is central to controlling their aggregation. Polarization effects, which are frequently ignored, are crucial to determine interactions when geometrical anisotropies are present due to surface-induced charge segregation. Here, we adopt a direct integral formulation that accounts for the problem of charged dielectric bodies immersed in a continuum media to explore particle aggregation via geometrical tuning. We show that by breaking the structural symmetry and modifying the close-contact surface between particles of equal charge, it is possible to obtain attractive regimes at short and long distances. We evaluate the electrostatic forces and energy of a set of dimers and trimers composed of spheres, oblates, and prolates in a vacuum, where no counter-ions are present, to construct a phase diagram with the conditions required to form stable aggregates as a function of the geometrical anisotropy. We found that it is possible to direct the aggregation (or dispersion) of two and three positive dielectric particles by adjusting their geometry and controlling the contact surface among them. Our results give insight into a way to control the aggregation of dielectric systems and offer a prospect for directing the assembly of complex particle structures.

Grain polydispersity and coherent crystal reorientations are features to foster stress hotspots in polycrystalline alloys under load.

The mechanical properties of metallic alloys are controlled through the design of their polycrystalline structure via heat treatments. For single-phase microstructures, they aim to achieve a particular average grain diameter to leverage stress hardening or softening. The stochastic nature of the recrystallization process generates a grain size distribution, and the randomness of the crystallographic orientation determines the anisotropy of a mechanical response. We developed a multiscale computational formalism to capture the collective mechanical response of polycrystalline microstructures at unprecedented length scales. We found that for an averaged grain size, the mechanical response is highly dependent on the grain size distribution. The simulations reveal the topological conditions that promote coherent grain texturization and grain growth inhibition during stress relaxation. We identify the microstructural features that are responsible for the appearance of stress hotspots. Our results provide the elusive evidence of how stress hotspots are ideal precursors for plastic and creep failure.

Leveling of Polymer Grating Structures upon Heating: Dimension Dependence on the Nanoscale and the Effect of Antiplasticizers.

The transition temperatures of nanoscale polymeric films are measured from a leveling experiment where a designed nanostructure is heated from below. Surface tension forces drive the relaxation of the polymeric features, allowing direct measurement of the critical temperature of collapse, Tflow, and indirect measurement of the glass transition temperature, TG. Small-angle X-ray scattering and atomic force microscopy are used to follow the leveling dynamics, whereas a mathematical model for the momentum balance is implemented to extract the viscosity of the polymer film as a function of temperature. Our methodology is illustrated in the context of films of poly(methyl methacrylate) that are patterned via nanoimprint lithography into dense gratings. We study how the glass transition temperature and the critical temperature of collapse vary as a function of the film size and the inclusion of the antiplasticizer, tris(2-chloropropyl) phosphate. The grating periods are varied consistently between 80 and 240 nm, whereas the antiplasticizer concentrations are 1, 3, 5, and 10 wt %. The solution of the momentum balance allows the detailed correlation between stresses, curvature, heating, and shear rates during leveling. We found that both temperatures, TG and Tflow, decrease as the film size decreases or as the concentration of the antiplasticizer increases. In addition, antiplasticizer concentrations between 3 and 5 wt % stabilize the size dependence of Tflow. We show that the nature of the antiplasticizer is effectively to increase the low-temperature viscosity of the film. However, during leveling, the antiplasticized film sustains its curvature, thereby driving a sudden relaxation, once TG is reached, and increasing the possibilities of defects.