Fabrication and characterization of anthocyanin-loaded double Pickering emulsions stabilized by ß-cyclodextrin.

Anthocyanins, one of the important water-soluble pigments, are sensitive to environmental factors, which limits the application of anthocyanins in food field. In order to overcome this limitation, double Pickering emulsions stabilized by ß-cyclodextrin were developed. The optimum preparation conditions of the emulsions were determined firstly and the performance and structure of emulsions were investigated. Results showed that the optimum preparation conditions of emulsions were the ratio of (W1/O): W2 = 6:4 and 4 % ß-cyclodextrin concentration. Optical microscope and confocal laser scanning microscope results confirmed that ß-cyclodextrin adsorbed onto the surface of droplets forming stable double Pickering emulsions structure. In vitro gastrointestinal digestion experiments proved that double Pickering emulsions played a controlled-release effect in the small intestine. Rheological analysis proved that the emulsions exhibited elastic properties and demonstrated shear thinning behavior. The emulsions showed excellent stability under centrifugation and thermal conditions. These findings will promote anthocyanins' application in daily diet.

Wideband 1-bit reconfigurable transmission metasurface unit cell design in Ka-band with polarization hold and conversion.

In this paper, a wideband transmission unit cell is proposed for programmable metasurfaces operating in the Ka-band. The unit cell features a compact period of only 2.91 mm, corresponding to 0.34 λ0 at the center frequency of 35 GHz. A receiving layer, consisting of a patch loaded with two PIN diodes, is utilized to achieve 1-bit phase modulation, while a U-shaped patch serves as the transmitting layer to enable selection of linear polarization hold or conversion. Based on the multi-resonance principle, the proposed unit cell exhibits broadband behavior, as demonstrated by simulation results under periodic boundary conditions, which indicate a 3 dB transmission bandwidth of 29.4-40 GHz (30.5%). Two unit cells were fabricated and tested in a standard waveguide, with the minimum insertion loss of the two states tested being 1.2 dB and 3 dB bandwidths of 30.1-31.2 GHz and 33.5-38.5 GHz, respectively. The maximum 180° phase error is 10°, indicating the high quality of the proposed unit cell.

Microstructure and shear properties of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling.

Through ultrasonic wave assisted Sn2.5Ag0.7Cu0.1RExNi/Cu (x = 0, 0.05, 0.1) soldering test and - 40 to 125 °C thermal shock test, the microstructure and shear properties of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal cycling were studied by the SEM, EDS and XRD. The results show that the Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints with high quality and high reliability can be obtained by ultrasonic assistance. When the ultrasonic vibration power is 88 W, the ultrasonic-assisted Sn2.5Ag0.7Cu0.1RE0.05Ni/Cu solder joints exhibits the optimized performance. During the thermal cycling process, the shear strength of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had a linear relationship with the thickness of interfacial intermetallic compound (IMC). Under the thermal cycling, the interfacial IMC layer of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints consisted of (Cu,Ni)6Sn5 and Cu3Sn. The thickness of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints was linearly related to the square root of equivalent time. The growth of interfacial IMC of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints had an incubation period, and the growth of IMC was slow within 300 cycles. And after 300 cycles, the IMC grew rapidly, the granular IMC began to merge, and the thickness and roughness of IMC increased obviously, which led to a sharp decrease in the shear strength of the solder joints. The 0.05 wt% Ni could inhibit the excessive growth of IMC, improve the shear strength of solder joints and improve the reliability of solder joints. The fracture mechanism of ultrasonic-assisted Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints changed from the ductile-brittle mixed fracture in the solder/IMC transition zone to the brittle fracture in the interfacial IMC.