Effects of Mechanical Stress on Insulation Structure and Performance of HV Cable.

Mechanical stresses generated during manufacturing and laying process of high voltage cables can result in degradation of insulation properties, affecting the stable operation of the transmission system. Traditional test methods for testing the effect of mechanical stress on the insulation properties of polyethylene still have some shortcomings to be explored and it is able to explain the changes of the insulation properties of polyethylene under mechanical stress from a microscopic perspective. In order to further study the effect of stress on the insulation properties of polyethylene, microstructural changes, the breakdown field strength, conductivity and charge distribution of polyethylene at different elongation rates are investigated by a combination of experimental and molecular dynamics simulations. The results show that the increase in stress leads to a decrease in crystallinity and microcrystalline size of the material decrease. The untwisting and orientation of the polyethylene molecular chains during the stretching process can create cavities, resulting in an uneven sample distribution and thickness reduction, leading to a reduction in the breakdown field strength. Meanwhile, some crystal regions are transformed into amorphous regions. The loose amorphous regions facilitate the directional migration of carriers, resulting in the increase of conductivity. When the elongation ratio is smaller, the distance between the molecular chains increases and the trap depth of the specimen becomes shallower. This facilitates the migration of ions and electrons and increases the rate of decay of the surface potential. When the stretch is further increased, new traps are created by broken molecular chains to limit the movement of charges, decreasing the decay rate of the surface potential and reducing the insulation properties of the polyethylene. Meanwhile, the molecular dynamics model of semi-crystalline polyethylene was developed to observe the microstructure and energy changes during the stretching process. The conclusions in terms of tensile tests were verified from a microscopic perspective.

Synergistic Enhanced Thermal Conductivity and Dielectric Constant of Epoxy Composites with Mesoporous Silica Coated Carbon Nanotube and Boron Nitride Nanosheet.

Dielectric materials with high thermal conductivity and outstanding dielectric properties are highly desirable for advanced electronics. However, simultaneous integration of those superior properties for a material remains a daunting challenge. Here, a multifunctional epoxy composite is fulfilled by incorporation of boron nitride nanosheets (BNNSs) and mesoporous silica coated multi-walled carbon nanotubes (MWCNTs@mSiO2). Owing to the effective establishment of continuous thermal conductive network, the obtained BNNSs/MWCNTs@mSiO2/epoxy composite exhibits a high thermal conductivity of 0.68 W m-1 K-1, which is 187% higher than that of epoxy matrix. In addition, the introducing of mesoporous silica dielectric layer can screen charge movement to shut off leakage current between MWCNTs, which imparts BNNSs/MWCNTs@mSiO2/epoxy composite with high dielectric constant (8.10) and low dielectric loss (<0.01) simultaneously. It is believed that the BNNSs/MWCNTs@mSiO2/epoxy composites with admirable features have potential applications in modern electronics.