Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation.

The integration of assembled foils in injection-molded parts is a challenging step. Such assembled foils typically comprise a plastic foil on which a circuit board is printed and electronic components are mounted. Those components can detach during overmolding when high pressures and shear stresses prevail due to the injected viscous thermoplastic melt. Hence, the molding settings significantly impact such parts' successful, damage-free manufacturing. In this paper, a virtual parameter study was performed using injection molding software in which 1206-sized components were overmolded in a plate mold using polycarbonate (PC). In addition, experimental injection molding tests of that design and shear and peel tests were made. The simulated forces increased with decreasing mold thickness and melt temperature and increasing injection speed. The calculated tangential forces in the initial stage of overmolding ranged from 1.3 N to 7.3 N, depending on the setting used. However, the experimental at room temperature-obtained shear forces at break were at least 22 N. Yet, detached components were present in most of the experimentally overmolded foils. Hence, the shear tests performed at room temperature can only provide limited information. In addition, there might be a peel-like load case during overmolding where the flexible foil might bend during overmolding.

Influence of Injection Molding Parameters on the Peel Strength between Plasma-Treated Fluoropolymer Films and Polycarbonate.

Light guiding is used to direct light from an emitting source to a different location. It is frequently realized through a clad-core structure with a difference in the refractive index of the materials. This paper explores the possibility of combining a fluoropolymer (THV) film of low refractive index, serving as a cladding layer, with a polycarbonate (PC) core, via injection molding. Pristine THV lacks adherence to the PC. However, when treated with O2 plasma prior to overmolding, bonding can be established that was quantified in peel tests. The effect of this surface treatment was further investigated by adjusting the plasma treatment duration and time to overmolding. Furthermore, parameter studies comprising the four molding parameters, namely packing pressure, injection speed, melt temperature, and mold temperature, were performed. Numerical injection molding simulations assessed the prevailing temperatures at the PC-THV boundary. Consequently, the temperature-time integral could be calculated and linked with the measured peel strengths by fitting a proportionality constant. While the plasma treatment duration showed minor influence, the activation diminished with time, halving the measured peel loads within 24 h. The adhesion was experimentally found to increase with a lower packing pressure, faster injection speed, and higher melt and mold temperature. Those same molding relations influencing the peel loads were also found with the temperature-time integral when scaled by the proportionality constant in the simulations (R2=85%). Apparently, adhesion is added by molding settings which promote higher interface temperatures that prevail for longer. Hereby, the faster injection speed increases the melt temperature through shear heating. A higher packing pressure, in contrast, presumably increases the heat transfer at the PC-THV interface, accelerating the cooling. The measured peel loads were 0.3-1.6 N/mm for plasma-treated samples and nearly zero for pristine THV.

Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion.

The integration of structural electronics in injection-molded parts is a challenging step. The films-comprising of laminated stacks with electronics-are exposed to shear stresses and elevated temperatures by the molten thermoplastic. Hence, molding settings have a significant impact on the successful, damage-free manufacturing of such parts. In this paper, test films with polycarbonate (PC) sheets as outer and two different thermoplastic polyurethanes (TPUs) as middle layers incorporating conductive tracks on a flexible printed circuit board (flexPCB) are manufactured and overmolded with PC. Parameter studies investigating the influence of the melt temperature, mold temperature, injection speed and used TPU layer were performed. The molded parts were inspected visually and compared with a numerical simulation using injection molding software. A shear distortion factor for the TPU layer was derived based on the simulations that linked the shear stresses with the injection time and the softening (melting) of the TPU. The distortion of the films was found to reduce with higher melt temperature, lower mold temperature and faster injection speed. Films using the TPU with the higher melting temperature yielded significantly better results. Moreover, distortion on the films reduced with the increasing distance to the gate and a larger cavity thickness was found to be beneficial. All those relations could be correlated with the shear distortion factor.

Combined Crack Initiation and Crack Growth Model for Multi-Layer Polymer Materials.

The current publication deals with the fracture toughness of polymeric multi-layer materials. In detail, the crack initiation and growth, crack arrest, and crack re-initiation of a multi-layer material are examined. The aim is to develop a numerical model for crack initiation and incremental crack growth of a three-layer single edge notched bending specimen that features one brittle layer in a plastically deforming matrix. Crack initiation and crack propagation are modeled using the finite fracture mechanics concept and the energy concept, respectively. No delamination is accounted for and the crack grows in one plane. The experimental observation of a crack initiating in the brittle layer (at 61.4 ± 2.2 N) while the initial crack is blunting can be reproduced well with the numerical model (at 63.6 N) with a difference of <3.6%. The model is ready to be used for different layups to predict toughening mechanisms and damage tolerances in multi-layer materials.