Dataset for a Norwegian medium and low voltage power distribution system with industrial loads.

This article presents a dataset for a Norwegian industrial medium voltage (MV) and low voltage (LV) electric power distribution grid with load time series. The raw dataset was collected in collaboration with the Norwegian distribution grid company (DSO) Norgesnett as part of a pilot project in the Norwegian research centre CINELDI and was later anonymized and simplified into a secondary dataset, presented here. The load dataset comprises over three years of measurements of hourly load demand from 45 grid customers in the time period 2019-03-01 to 2022-03-16, collected from smart meters installed with the customers. The grid data comprises 2 radials of the distribution grid, collected from the network information system of the DSO. The data was anonymized and simplified. The dataset can be used for stochastic load modelling, analysing the grid's need for flexibility and power flow analyses for grid planning purposes.

Application of Synchrotron Radiation-Based Fourier-Transform Infrared Microspectroscopy for Thermal Imaging of Polymer Thin Films.

The thermal imaging of surfaces with microscale spatial resolution over micro-sized areas remains a challenging and time-consuming task. Surface thermal imaging is a very important characterization tool in mechanical engineering, microelectronics, chemical process engineering, optics, microfluidics, and biochemistry processing, among others. Within the realm of electronic circuits, this technique has significant potential for investigating hot spots, power densities, and monitoring heat distributions in complementary metal-oxide-semiconductor (CMOS) platforms. We present a new technique for remote non-invasive, contactless thermal field mapping using synchrotron radiation-based Fourier-transform infrared microspectroscopy. We demonstrate a spatial resolution better than 10 um over areas on the order of 12,000 um2 measured in a polymeric thin film on top of CaF2 substrates. Thermal images were obtained from infrared spectra of poly(methyl methacrylate) thin films heated with a wire. The temperature dependence of the collected infrared spectra was analyzed via linear regression and machine learning algorithms, namely random forest and k-nearest neighbor algorithms. This approach speeds up signal analysis and allows for the generation of hyperspectral temperature maps. The results here highlight the potential of infrared absorbance to serve as a remote method for the quantitative determination of heat distribution, thermal properties, and the existence of hot spots, with implications in CMOS technologies and other electronic devices.

Enhancement of Thermal Boundary Conductance of Metal-Polymer System.

In organic electronics, thermal management is a challenge, as most organic materials conduct heat poorly. As these devices become smaller, thermal transport is increasingly limited by organic-inorganic interfaces, for example that between a metal and a polymer. However, the mechanisms of heat transport at these interfaces are not well understood. In this work, we compare three types of metal-polymer interfaces. Polymethyl methacrylate (PMMA) films of different thicknesses (1-15 nm) were spin-coated on silicon substrates and covered with an 80 nm gold film either directly, or over an interface layer of 2 nm of an adhesion promoting metal-either titanium or nickel. We use the frequency-domain thermoreflectance (FDTR) technique to measure the effective thermal conductivity of the polymer film and then extract the metal-polymer thermal boundary conductance (TBC) with a thermal resistance circuit model. We found that the titanium layer increased the TBC by a factor of 2, from 59 × 106 W·m-2·K-1 to 115 × 106 W·m-2·K-1, while the nickel layer increased TBC to 139 × 106 W·m-2·K-1. These results shed light on possible strategies to improve heat transport in organic electronic systems.