Deflecting Dendrites by Introducing Compressive Stress in Li7La3Zr2O12 Using Ion Implantation.

Lithium dendrites belong to the key challenges of solid-state battery research. They are unavoidable due to the imperfect nature of surfaces containing defects of a critical size that can be filled by lithium until fracturing the solid electrolyte. The penetration of Li metal occurs along the propagating crack until a short circuit takes place. It is hypothesized that ion implantation can be used to introduce stress states into Li6.4La3Zr1.4Ta0.6O12 which enables an effective deflection and arrest of dendrites. The compositional and microstructural changes associated with the implantation of Ag-ions are studied via atom probe tomography, electron microscopy, and nano X-ray diffraction indicating that Ag-ions can be implanted up to 1 µm deep and amorphization takes place down to 650-700 nm, in good agreement with kinetic Monte Carlo simulations. Based on diffraction results pronounced stress states up to -700 MPa are generated in the near-surface region. Such a stress zone and the associated microstructural alterations exhibit the ability to not only deflect mechanically introduced cracks but also dendrites, as demonstrated by nano-indentation and galvanostatic cycling experiments with subsequent electron microscopy observations. These results demonstrate ion implantation as a viable technique to design "dendrite-free" solid-state electrolytes for high-power and energy-dense solid-state batteries.

Zirconium Carbide Mediates Coke-Resistant Methane Dry Reforming on Nickel-Zirconium Catalysts.

Graphitic deposits anti-segregate into Ni0 nanoparticles to provide restored CH4 adsorption sites and near-surface/dissolved C atoms, which migrate to the Ni0 /ZrO2 interface and induce local Zrx Cy formation. The resulting oxygen-deficient carbidic phase boundary sites assist in the kinetically enhanced CO2 activation toward CO(g). This interface carbide mechanism allows for enhanced spillover of carbon to the ZrO2 support, and represents an alternative catalyst regeneration pathway with respect to the reverse oxygen spillover on Ni-CeZrx Oy catalysts. It is therefore rather likely on supports with limited oxygen storage/exchange kinetics but significant carbothermal reducibility.

Biomimetic hard and tough nanoceramic Ti-Al-N film with self-assembled six-level hierarchy.

Nature uses self-assembly of a fairly limited selection of components to build hard and tough protective tissues like nacre and enamel. The resulting hierarchical micro/nanostructures provide decisive toughening mechanisms while preserving strength. However, to mimic microstructural and mechanical characteristics of natural materials in application-relevant synthetic nanostructures has proven to be difficult. Here, we demonstrate a biomimetic synthesis strategy, based on chemical vapour deposition technology, employed to fabricate a protective high-temperature resistant nanostructured ceramic TiAlN thin film with six levels of hierarchy. By using just two variants of gaseous precursors and through bottom-up self-assembly, an irregularly arranged hard and tough multilayer stack was formed, consisting of hard sublayers with herringbone micrograins, separated by tough interlayers with spherical nanograins, respectively composed of lamellar nanostructures of alternating coherent/incoherent, hard/tough, single-/poly-crystalline platelets. Micro- and nanomechanical testing, performed in situ in scanning and transmission electron microscopes, manifests intrinsic toughening mechanisms mediated by five types of interfaces resulting in intergranular, transgranular and cleavage fracture modes with zigzag-like crack patterns at multiple length-scales. The hierarchical 2.7 µm thick film self-assembled during ∼15 minutes of deposition time shows hardness, fracture stress and toughness of ∼31 GPa, ∼7.9 GPa and ∼4.7 MPa m0.5, respectively, as well as phase/microstructural thermal stability up to ∼950/900 °C. The film's microstructural and mechanical characteristics represent a milestone in the production of protective and wear-resistant thin films.

Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si(001) wafers and Cu overlayers.

We compare the performance of conventional DC magnetron sputter-deposited (DCMS) TiN diffusion barriers between Cu overlayers and Si(001) substrates with Ti0.84Ta0.16N barriers grown by hybrid DCMS/high-power impulse magnetron sputtering (HiPIMS) with substrate bias synchronized to the metal-rich portion of each pulse. DCMS power is applied to a Ti target, and HiPIMS applied to Ta. No external substrate heating is used in either the DCMS or hybrid DCMS/HiPIMS process in order to meet future industrial thermal-budget requirements. Barrier efficiency in inhibiting Cu diffusion into Si(001) while annealing for 1 hour at temperatures between 700 and 900 °C is investigated using scanning electron microscopy, X-ray diffraction, four-point-probe sheet resistance measurements, transmission electron microscopy, and energy-dispersive X-ray spectroscopy profiling. Ti0.84Ta0.16N barriers are shown to prevent large-scale Cu diffusion at temperatures up to 900 °C, while conventional TiN barriers fail at ≤700 °C. The improved performance of the Ti0.84Ta0.16N barrier is due to film densification resulting from HiPIMS pulsed irradiation of the growing film with synchronized Ta ions. The heavy ion bombardment dynamically enhances near-surface atomic mixing during barrier-layer deposition.

In-situ Observation of Cross-Sectional Microstructural Changes and Stress Distributions in Fracturing TiN Thin Film during Nanoindentation.

Load-displacement curves measured during indentation experiments on thin films depend on non-homogeneous intrinsic film microstructure and residual stress gradients as well as on their changes during indenter penetration into the material. To date, microstructural changes and local stress concentrations resulting in plastic deformation and fracture were quantified exclusively using numerical models which suffer from poor knowledge of size dependent material properties and the unknown intrinsic gradients. Here, we report the first in-situ characterization of microstructural changes and multi-axial stress distributions in a wedge-indented 9 µm thick nanocrystalline TiN film volume performed using synchrotron cross-sectional X-ray nanodiffraction. During the indentation, needle-like TiN crystallites are tilted up to 15 degrees away from the indenter axis in the imprint area and strongly anisotropic diffraction peak broadening indicates strain variation within the X-ray nanoprobe caused by gradients of giant compressive stresses. The morphology of the multiaxial stress distributions with local concentrations up to -16.5 GPa correlate well with the observed fracture modes. The crack growth is influenced decisively by the film microstructure, especially by the micro- and nano-scopic interfaces. This novel experimental approach offers the capability to interpret indentation response and indenter imprint morphology of small graded nanostructured features.

The roles of Eu during the growth of eutectic Si in Al-Si alloys.

Controlling the growth of eutectic Si and thereby modifying the eutectic Si from flake-like to fibrous is a key factor in improving the properties of Al-Si alloys. To date, it is generally accepted that the impurity-induced twinning (IIT) mechanism and the twin plane re-entrant edge (TPRE) mechanism as well as poisoning of the TPRE mechanism are valid under certain conditions. However, IIT, TPRE or poisoning of the TPRE mechanism cannot be used to interpret all observations. Here, we report an atomic-scale experimental and theoretical investigation on the roles of Eu during the growth of eutectic Si in Al-Si alloys. Both experimental and theoretical investigations reveal three different roles: (i) the adsorption at the intersection of Si facets, inducing IIT mechanism, (ii) the adsorption at the twin plane re-entrant edge, inducing TPRE mechanism or poisoning of the TPRE mechanism, and (iii) the segregation ahead of the growing Si twins, inducing a solute entrainment within eutectic Si. This investigation not only demonstrates a direct experimental support to the well-accepted poisoning of the TPRE and IIT mechanisms, but also provides a full picture about the roles of Eu atoms during the growth of eutectic Si, including the solute entrainment within eutectic Si.

Nonlinear Lock-In Infrared Microscopy: A Complementary Investigation Technique for the Analysis of Functional Electroceramic Components.

Using lock-in infrared microscopy as a tool for current detection on the micrometer scale in AC-driven specimens in combination with iterative grinding procedure allows preparation of current dominating microstructure regions on well-polished surfaces. This technique is applied successfully on varistor components based on specially doped ZnO-based varistor ceramics. This peculiar electroceramic material exhibits exceptional high nonlinear current-voltage (I-V) characteristics, described by a power law according I~V(α), caused by double Schottky barriers at the grain boundaries. As a novelty the thermographic response is used to evaluate local electrical properties, namely the nonlinearity coefficient α, on basis of higher order harmonics with respect to the basic electrical driving AC-frequency. To correlate the observed electrical properties to the microstructure, the polar crystal orientation of the relevant ZnO grains is determined by combining electron backscatter diffraction and orientation-dependent patterns as a result of a chemical etching procedure. These findings support a modified new model for describing the grain boundary controlled current flow in a varistor microstructure including orientation-dependent barrier properties. Hence, the experimentally observed current direction-dependent behavior can be described consistently.