High-resolution resistless nanopatterning on polymer and flexible substrates for plasmonic biosensing using stencil masks.

The development of nanoscale lithographic methods on polymer materials is a key requirement to improve the spatial resolution and performance of flexible devices. Here, we report the fabrication of metallic nanostructures down to 20 and 50 nm in size on polymer materials such as polyimide, parylene, SU-8, and PDMS substrates without any resist processing using stencil lithography. Metallic nanodot array analysis of their localized surface plasmon spectra is included. We demonstrate plasmon resonance detection of biotin and streptavidin using a PDMS flexible film with gold nanodots. We also demonstrate the fabrication of metallic nanowires on polyimide substrates with their electrical characteristics showing an ohmic behavior. These results demonstrate high-resolution nanopatterning and device nanofabrication capability of stencil lithography on polymer and flexible substrates.

Compliant membranes improve resolution in full-wafer micro/nanostencil lithography.

This work reports on a considerable resolution improvement of micro/nanostencil lithography when applied on full-wafer scale by using compliant membranes to reduce gap-induced pattern blurring. Silicon nitride (SiN) membranes are mechanically decoupled from a rigid silicon (Si) frame by means of four compliant, protruding cantilevers. When pressing the stencil into contact with a surface to be patterned, the membranes thus adapt to the surface independently and reduce the gap between the membrane and the substrate even over large, uneven surfaces. Finite element modeling (FEM) simulations show that compliant membranes can deflect vertically 40 µm which is a typical maximal non-planarity observed in standard Si wafers, due to polishing. Microapertures in the stencil membrane are defined by UV lithography and nanoapertures, down to 200 nm in diameter, using focused ion beam (FIB). A thin aluminium (Al) layer is deposited through both compliant and non-compliant membranes on a Si wafer, for comparison. The blurring in the case of compliant membranes is up to 95% reduced on full-wafer scale compared to standard (non-compliant) membranes.

100 mm dynamic stencils pattern sub-micrometre structures.

Dynamic stencil lithography uses a moving shadow-mask to draw patterns by having directionally evaporated material deposited through the stencil apertures onto the substrate. Sub-micrometre, two-dimensional patterning is demonstrated at full 100 mm wafer scale, with two examples emphasizing this technique's unique features. Structures having a width-modulated height below a certain aperture size are fabricated by moving the stencil according to a two-dimensional trajectory. Variable-period gratings are obtained by translating a row of apertures at different orientations with respect to the row's axis. Despite the long deposition sequences one could envision for a stencil in dynamic mode, the apertures' active life-time in the sub-micrometre domain remains limited by the material's accretion on the membrane, resulting in the eventual clogging of the openings. A novel solution to this problem containing a micro-heater embedded in the membrane is described and its effectiveness in preventing material from clogging the apertures is demonstrated.

High throughput nanofabrication of silicon nanowire and carbon nanotube tips on AFM probes by stencil-deposited catalysts.

A new and versatile technique for the wafer scale nanofabrication of silicon nanowire (SiNW) and multiwalled carbon nanotube (MWNT) tips on atomic force microscope (AFM) probes is presented. Catalyst material for the SiNW and MWNT growth was deposited on prefabricated AFM probes using aligned wafer scale nanostencil lithography. Individual vertical SiNWs were grown epitaxially by a catalytic vapor-liquid-solid (VLS) process and MWNTs were grown by a plasma-enhanced chemical vapor (PECVD) process on the AFM probes. The AFM probes were tested for imaging micrometers-deep trenches, where they demonstrated a significantly better performance than commercial high aspect ratio tips. Our method demonstrates a reliable and cost-efficient route toward wafer scale manufacturing of SiNW and MWNT AFM probes.