Fabrication of wafer-scale nanoporous AlGaN-based deep ultraviolet distributed Bragg reflectors via one-step selective wet etching.

In this paper, we reported on wafer-scale nanoporous (NP) AlGaN-based deep ultraviolet (DUV) distributed Bragg reflectors (DBRs) with 95% reflectivity at 280 nm, using epitaxial periodically stacked n-Al0.62Ga0.38N/u-Al0.62Ga0.38N structures grown on AlN/sapphire templates via metal-organic chemical vapor deposition (MOCVD). The DBRs were fabricated by a simple one-step selective wet etching in heated KOH aqueous solution. To study the influence of the temperature of KOH electrolyte on the nanopores formation, the amount of charge consumed during etching process was counted, and the surface and cross-sectional morphology of DBRs were characterized by Scanning electron microscopy (SEM) and atomic force microscopy (AFM). As the electrolyte temperature increased, the nanopores became larger while the amount of charge reduced, which revealed that the etching process was a combination of electrochemical and chemical etching. The triangular nanopores and hexagonal pits further confirmed the chemical etching processes. Our work demonstrated a simple wet etching to fabricate high reflective DBRs, which would be useful for AlGaN based DUV devices with microcavity structures.

Flexible assembly of the PEDOT: PSS/ exfoliated ß-Ga2O3 microwire hybrid heterojunction for high-performance self-powered solar-blind photodetector.

Motivated by the goals of fabricating highly reliable, high performance, and cost-efficient self-powered photodetector (PD) for numerous scientific research and civil fields, an organic-inorganic hybrid solar-blind ultraviolet (UV) PD based on PEDOT: PSS/exfoliated ß-Ga2O3 microwire heterojunction was fabricated by a flexible and cost-effective assembly method. Benefiting from the heterojunction constructed by the highly crystalline ß-Ga2O3 and the excellent hole transport layer PEDOT: PSS, the device presents a high responsivity of 39.8 mA/W at 250 nm and a sharp cut-off edge at 280 nm without any power supply. Additionally, the ultra-high normalized photo-to-dark current ratio (> 104 mW-1cm2) under reverse bias and the superior detectivity of 2.4×1012 Jones at zero bias demonstrate the excellent detection capabilities. Furthermore, the hybrid PD exhibits a rapid rise time (several milliseconds) and high rejection ratio (R250/R365: 5.8 × 103), which further highlights its good spectral selectivity for solar-blind UV. The prominent performance is mainly ascribed to the efficient separation of the photogenerated carriers by the large built-in electric field of the advanced heterojunction. This flexible assembly strategy for solar-blind UV PD combines the advantages of high efficiency, low cost and high performance, providing more potential for PD investigation and application in the future.

Full wafer scale electroluminescence properties of AlGaN-based deep ultraviolet LEDs with different well widths.

Deep ultraviolet (DUV) LEDs have great potential in sterilization, water, air purification, and other fields. In this work, DUV LED wafers with different quantum well (QW) widths were grown by metal-organic chemical vapor deposition. It is found that the light output power (LOP) and peak wavelength of all chips are not only related to the QW thickness but also affected by warpage. For the first time, to the best of our knowledge, a positive correlation between the LOP and peak wavelength of DUV LED chips on the same wafer was observed, which is very important for improving the yield of DUV LEDs and reducing costs. Furthermore, the influence of QW thickness on the external quantum efficiency (EQE) of DUV LED has also been investigated. As the thickness of the QW increases, the exciton localization effect decreases and the quantum confinement Stark effect increases. Consequently, DUV LED wafers with a QW thickness of 2 nm have the highest EQE and yield. These findings not only help to improve the efficiency of DUV LEDs but also provide new insights for evaluating the performance of DUV LED wafers.

Enhanced Performance of AlGaN-Based Deep Ultraviolet Light-Emitting Diodes with Chirped Superlattice Electron Deceleration Layer.

AlGaN-based deep ultraviolet (DUV) light-emitting diodes (LEDs) suffer from electron overflow and insufficient hole injection. In this paper, novel DUV LED structures with superlattice electron deceleration layer (SEDL) is proposed to decelerate the electrons injected to the active region and improve radiative recombination. The effects of several chirped SEDLs on the performance of DUV LEDs have been studied experimentally and numerically. The DUV LEDs have been grown by metal-organic chemical vapor deposition (MOCVD) and fabricated into 762 × 762 µm2 chips, exhibiting single peak emission at 275 nm. The external quantum efficiency of 3.43% and operating voltage of 6.4 V are measured at a forward current of 40 mA, indicating that the wall-plug efficiency is 2.41% of the DUV LEDs with ascending Al-content chirped SEDL. The mechanism responsible for this improvement is investigated by theoretical simulations. The lifetime of the DUV LED with ascending Al-content chirped SEDL is measured to be over 10,000 h at L50, due to the carrier injection promotion.