Active electrode arrays by chip embedding in a flexible silicone carrier.

Future cochlear implants demand a higher density of stimulation sites (electrodes) and enhanced functionality (e.g. feedback information). The current generation of implanted cochlear prostheses is making use of a completely "passive scheme" and cannot meet these requirements. An "all-silicon" concept integrating active components with passive electrodes in silicon has been proposed but does not offer the flexibility/stretchability of current silicone-based devices. This paper introduces a novel concept based on silicon chip embedding in a flexible silicone carrier. The process and experimental results will be presented. The concept is also applicable to other types of implanted electrodes, e.g. retinal implants.