RESUMO
As the feature size of integrated circuits has been scaled down to 10 nm, the rapid increase in the electrical resistance of copper (Cu) metallization has become a critical issue. To alleviate the resistance increases of Cu lines, co-sputtered CoW and CoB alloying metals were investigated as conductors and barriers in this study. Annealing CoM (M = W or B)/SiO2/p-Si structures reduced the resistivity of CoM alloys, removed sputtering-deposition-induced damage, and promoted adhesion. Additionally, both annealed CoW/SiO2 or CoB/SiO2 structures displayed a negligible Vfb shift from capacitance-voltage measurements under electrical stress, revealing an effective barrier capacity, which is attributed to the formation of MOx layers at the CoM/SiO2 interface. Based on the thermodynamics, the B2O3 layer tends to form more easily than the WOx layer. Hence, the annealed CoB/SiO2/p-Si MIS capacitor had a higher capacitance and a larger breakdown strength did than the annealed CoW/SiO2/p-Si MIS capacitor.
