RESUMO
Polyacrylic pressure-sensitive adhesives (PSAs) based on butyl acrylate (BA), 2-hydroxyethyl acrylate (HEA), and acrylic acid (AA) were prepared by a bulk polymerization process triggered by a radical photoinitiator under UV irradiation and UV-crosslinking. 1,6-Hexanediol diacrylate (HDDA) with difunctional groups was introduced into the PSAs to modify semi-interpenetrating network structures. The effect of HDDA content on the pressure-sensitive performance was comprehensively tested. The viscosity of the prepolymer was measured by a rotational viscometer. Prepolymers obtained by a photoinduced process and UV crosslinking process were confirmed via Fourier transform infrared spectroscopy (FTIR). All double bonds participated in the copolymerization without any remaining monomers, which reflected the concept of green environmental protection. Gel content in the crosslinked portion was examined by Soxhlet extraction, whilst the soluble molecular weight of PSAs was characterized by gel permeation chromatography (GPC). The viscoelastic properties of polymer films were determined by dynamic mechanical analysis (DMA). The T g value and storage modulus (G') of the PSAs were enhanced with the addition of HDDA. Moreover, three fundamental adhesive properties, i.e. loop tack force, peel force and shear strength of PSAs, were measured. The results showed that UV crosslinking technology achieved a good balance of the three forces with excellent pressure-sensitive properties.
RESUMO
A new epoxy-based composite with higher toughness and thermal conductivity was developed. First, a poly(n-butyl acrylate)/poly(methyl methacrylate-co-glycidyl methacrylate) (PBMG) core-shell structured latex was prepared by seeded emulsion polymerization to toughen the epoxy resin (EP). Second, boron nitride particles were modified into nano-scale sheets and added to the epoxy/PBMG blend to improve the thermal conductivity of the resulting composite material. The properties of the constituent materials were determined prior to fabrication and testing of the composite product. The monomer conversion in the emulsion polymerization process of the PBMG was checked by determining the solid particle content. The PBMG particle size was characterized by dynamic laser scattering, and the morphology of the particles was characterized by scanning and transmission electron microscopy. The exfoliation of the modified boron nitride (MBN) flakes was verified by TEM and Raman microscopy. The mechanical properties and the thermal conductivity of the EP/PBMG/MBN composite were determined at various constituent contents. Results showed that the unnotched impact strength of the composite increased by 147%, the flexural strength increased by 49.1%, and the thermal conductivity increased by 98% compared with pristine EP at a PBMG content of 5 wt% and MBN content of 7 wt%. With the enhanced properties and ease of fabrication, the developed composite has good potential for application in high-end industries such as microelectronics packaging.
