Preparation of PANI/CuPc/PDMS Composite Elastomer with High Dielectric Constant and Low Modulus Assisted by Electric Fields.

Dielectric elastomer is a kind of electronic electroactive polymer, which plays an important role in the application of soft robots and flexible electronics. In this study, an all-organic polyaniline/copper phthalocyanine/silicone rubber (PANI/CuPc/PDMS) dielectric composite with superior comprehensive properties was prepared by manipulating the arrangement of filler in a polymer matrix assisted by electric fields. Both CuPc particles and PANI particles can form network structures in the PDMS matrix by self-assembly under electric fields, which can enhance the dielectric properties of the composites at low filler content. The dielectric constant of the assembled PANI/CuPc/PDMS composites can reach up to 140 at 100 Hz when the content of CuPc and PANI particles is 4 wt% and 2.5 wt%, respectively. Moreover, the elastic modulus of the composites remains below 2 MPa, which is important for electro-deforming. The strain of assembled PANI/CuPc/PDMS three-phase composites at low electric field strength (2 kV/mm) can increase up to five times the composites with randomly dispersed particles, which makes this composite have potential application in the field of soft robots and flexible electronics.

High-Dielectric PVP@PANI/PDMS Composites Fabricated via an Electric Field-Assisted Approach.

Polymer-based composite films with multiple properties, such as low dielectric loss tangent, high dielectric constant, and low cost are promising materials in the area of electronics and electric industries. In this study, flexible dielectric films were fabricated via an electric field-assisted method. Polyaniline (PANI) was modified by polyvinylpyrrolidone (PVP) to form a core-shell structure to serve as functional particles and silicone rubber polydimethylsiloxane (PDMS) served as the matrix. The dielectric constant of the composites prepared under electric fields was improved by the micro-structures formed by external electric fields. With the addition of 2.5 wt% PVP@PANI, the dielectric constant could be significantly enhanced, up to 23; the dielectric loss tangent is only 1, which is lower than that of the aligned PANI samples. This new processing technology provides important insights for aligning fillers in polymer matrix to form composites with enhanced dielectric properties.