Upstream mobility and swarming of light activated micromotors.

Micromotors have been proposed for applications such as targeted drug delivery, thrombolysis, or sensing. However, single micrormotors are limited in the amount of payload they can deliver or force they can exert. Swarms of micromotors can overcome many of these challenges, however creating and controlling such swarms presents many challenges of its own. In particular, utilizing swarms in fluid flows is of significant importance for biomedical or lab-on-chip applications. Here, the upstream mobility and swarm formation of light driven micromotors in microchannel flows is demonstrated with maximum speeds around 0.1 mm s-1. Additionally, the light actuated microrobots operate in fairly low concentrations of hydrogen peroxide of approximately 1%. The micromotors form swarms at the boundary of the locally applied light pattern and the swarms can be moved by translating the light up or downstream.

Multistimuli-responsive microrobots: A comprehensive review.

Untethered robots of the size of a few microns have attracted increasing attention for the potential to transform many aspects of manufacturing, medicine, health care, and bioengineering. Previously impenetrable environments have become available for high-resolution in situ and in vivo manipulations as the size of the untethered robots goes down to the microscale. Nevertheless, the independent navigation of several robots at the microscale is challenging as they cannot have onboard transducers, batteries, and control like other multi-agent systems, due to the size limitations. Therefore, various unconventional propulsion mechanisms have been explored to power motion at the nanoscale. Moreover, a variety of combinations of actuation methods has also been extensively studied to tackle different issues. In this survey, we present a thorough review of the recent developments of various dedicated ways to actuate and control multistimuli-enabled microrobots. We have also discussed existing challenges and evolving concepts associated with each technique.

A First-Order Approach to Model Simultaneous Control of Multiple Microrobots.

The control of swarm systems is relatively well understood for simple robotic platforms at the macro scale. However, there are still several unanswered questions about how similar results can be achieved for microrobots. In this paper, we propose a modeling framework based on a dynamic model of magnetized self-propelling Janus microrobots under a global magnetic field. We verify our model experimentally and provide methods that can aim at accurately describing the behavior of microrobots while modeling their simultaneous control. The model can be generalized to other microrobotic platforms in low Reynolds number environments.

Ultrafast air bonding between SiC ceramic and SnAgTi alloy under the action of ultrasounds.

With the aim of overcoming the limitations of traditional soldering ceramic methods for power device packaging, a simple but ultrafast bonding technology is reported. The effect and mechanism of ultrasonic action on the interfacial bonding and microstructure is investigated and thoroughly discussed. An ultrafast interfacial bond between SiC ceramics and SnAgTi active solder has been successfully achieved through a reaction at the interface at a low temperature of 250 °C in the extremely short time. High-resolution transmission electron microscopy (HRTEM) revealed that a silica layer on the surface of SiC reacted with Ti from the SnAgTi active solder to form a nanometer-thickness amorphous titania layer at the interface under the ultrasonic action, which creates an exceptional interfacial structure and facilitates bonding between the two dissimilar crystals. A discontinuous titania layer at the interface was identified within 0.1 s. With further increasing ultrasonic action time to 1 s, a continuous titania layer with a thickness of 7.6 ± 0.5 nm formed at the interface. A new interfacial reaction mechanism was revealed and it was found that ultrasound accelerated the reaction of liquid active solder/ceramic. Our finding demonstrated that ultrasound could be an effective approach for joining ceramics which is difficult to wet by a liquid metal at low temperature. The combined impact of ultrasonic cavitation and streaming dominated the mechanism and kinetics of the rapid interfacial reaction.

Microstructural evolution of SiC joints soldered using Zn-Al filler metals with the assistance of ultrasound.

SiC ceramics were successfully soldered with the assistance of ultrasound. Two kinds of filler metals, namely non-eutectic Zn-5Al-3Cu and eutectic Zn-5Al alloys, were used. The effects of ultrasonic action on the microstructure and mechanical properties of the soldered joints were investigated. The results showed that ultrasound could promote the wetting and bonding between the SiC ceramic and filler metals within tens of seconds. For the Zn-5Al-3Cu solder, a fully grain-refined structure in the bond layer was obtained as the ultrasonic action time increased. This may lead to a substantial enhancement in the strength of the soldered joints. For the Zn-5Al solder, the shear strength of the soldered joints was only ∼102 MPa when the ultrasonic action time was shorter, and fractures occurred in the brittle lamellar eutectic phases in the center of the bond layer. With increasing ultrasonic action time, the lamellar eutectic phase in the bond layer of SiC joints could be completely transformed to a fine non-lamellar eutectic structure. Meanwhile, the grains in the bond layer were obviously refined. Those results led to the remarkable enhancement of the shear strength of the joints (∼138 MPa) using the Zn-5Al solder, which had approached that enhancement using the Zn-5Al-3Cu solder. The enhanced mechanical properties of the joints were attributed to the significant refinement of the grains and the change in the eutectic structure in the bond layer. Prolonged enhanced heterogeneous nucleation triggered by ultrasonic cavitation is the predominant refinement mechanism of the bond metals of the SiC joints.