Hydrogen Production through Distinctive C-C Cleavage during Acetic Acid Reforming at Low Temperature.

Acetic acid reforming is a green method for sustainable hydrogen production owing to its renewable source from biomass conversion. However, conventional acetic acid reforming would produce various byproducts, including CO, CH4 and so on. Here, we develop a distinctive method for selective hydrogen production from C-C directional cleavage during acetic acid reforming. Completely different from conventional acetic acid reforming process, acetic acid would react with water over organoruthenium catalyst during its C-C cleavage at low temperature, then produce methanol and formic acid (CH3COOH+H2O→CH3OH+HCOOH). Lastly, methanol and formic acid could further decompose into hydrogen and carbon dioxide over organoruthenium selectively. As a result, there is little CO and CH4 produced in the first step of C-C bond cleavage during acetic acid reforming at 100 °C. Hydrogen production rate is up to 26.8 molH2/(h-1*mol-1 Ru) at 150 °C through a tandem catalysis. A mechanism for C-C cleavage of acetic acid is proposed based on intermediate product analysis and density functional theory (DFT) calculation. Firstly, the C-C single bond was transformed into C=C double bond by dropping one H atom to organoruthenium. Then the coming H2O molecule reacted with the C=C bond by an addition reaction, forming methanol and formic acid. This research not only proposes distinctive reaction pathway for hydrogen production from acetic acid reforming, but also provides some inspiration for selective C-C bond cleavage during ethanol reforming.

The Influence of Heat Treatment Temperature on Tensile Properties of Metal-Bonded Diamond Composites Fabricated via Selective Laser Melting.

Selective Laser Melting (SLM) is an effective technology for fabricating new types of porous metal-bonded diamond tools with complex geometries. However, due to the high cooling rate and internal stresses during SLM fabrication, defects such as high porosities and interface gaps still need to be resolved before it can be considered for use in other applications. The influence of heat treatment temperature on internal characterization, interface microstructures, and tensile properties of AlSi7Mg-bonded diamond composites fabricated by SLM were investigated in this work. From experimental results, the porosities of HT-200, HT-350, and HT-500 specimens were 12.19%, 11.37%, and 11.14%, respectively, showing a slightly lower percentage than that of the No-HT specimen (13.34%). Here, HT represents "Heat Treatment". For No-HT specimens, an obvious un-bonding area can be seen in the interface between AlSi7Mg and diamond, whereas a relative closer interface can be observed for HT-500 specimens. After heat treatment, the elastic modulus of specimens showed a relative stable value (16.77 ± 2.79~18.23 ± 1.72 GPa), while the value of yield strength decreased from 97.24 ± 4.48 to 44.94 ± 7.06 MPa and the value of elongation increased from 1.98 ± 0.05 to 6.62 ± 0.51%. This difference can be attributed mainly to the disappearance of the solid-solution hardening effect due to the increase of Si content after heat treatment.