RESUMO
This paper reports on a new type of high-frequency mode-matched gyroscope with significantly reduced dependencies on environmental stimuli such as temperature, vibration, and shock. A novel stress-isolation system is used to effectively decouple an axis-symmetric bulk-acoustic wave (BAW) vibratory gyro from its substrate, minimizing the effect that external sources of error have on the offset and scale factor of the device. Substrate-decoupled (SD) BAW gyros with a resonance frequency of 4.3 MHz and Q values near 60 000 were implemented using the high aspect ratio poly and single-crystal silicon (HARPSS) process to achieve ultra-narrow capacitive gaps. Wafer-level packaged sensors were interfaced with a customized application-specific integrated circuit (ASIC) to achieve low variations in the offset across temperature (±26° s-1 from -40 to 85 °C), supreme random-vibration immunity (0.012° s-1 gRMS -1) and excellent shock rejection. With a scale factor of 800 µV (°s-1)-1, the SD-BAW gyro system attains a large full-scale range (±1250° s-1) with a non-linearity of less than 0.07%. A measured angle-random walk (ARW) of 0.39°/âh and a bias instability of 10.5°h-1 are dominated by the thermal and flicker noise of the integrated circuit (IC), respectively. Additional measurements using external electronics show bias-instability values as low as 3.5°h-1, which are limited by feed-through signals coupled from the drive loop to the sense channel, which can be further reduced through proper re-routing of the gyroscope pin-out configuration.
