RESUMO
A thermal elastic viscoplastic self-consistent model is utilized to examine the thermal stress induced by the thermal anisotropy of single crystals during heat treatments. This model considers temperature-dependent elastic constants and critical resolved shear stress associated with thermal dilation. Simulation results demonstrate that under cooling, the elastic lattice strain increases significantly when constrained compared to unconstrained cooling. The deformation mechanism observed under cooling with constraint resembles tension along the constrained direction at room temperature. Polycrystals offer more deformation mechanisms to accommodate thermal anisotropy compared to single crystals, resulting in lower applied stress at the constrained boundary. Among the various observed textures, the maximum amplitude of residual lattice strain follows the following order: rolled > extruded > random. Lower thermal anisotropy in the entire polycrystal structure leads to reduced internal stress. For a single crystal within aggregates, the {00.2} plane experiences tensile lattice strain, while the {10.0} and {11.0} planes undergo compressive lattice strain due to the greater contraction of single crystals along the
