Solid-phase transient soldering method based on Au/Ni-W multilayer thin-film-modified copper-based structures.

The copper crystal cone-shaped micro-nanostructure is used as the substrate, and the Ni-W alloy layer and Au nanolayer are plated sequentially. Instantaneous soldering with lead-free solder is realized under ultrasonic assistance at room temperature. This solves the residual stress and thermal damage caused by high melting point lead-free solder on thin chips and thermal components, and ensures the safety and reliability of electronic components. Copper-based microstructures are deposited by electrochemical methods. An amorphous Ni-W alloy layer with a thickness of 180 nm is deposited on the Cu-based microstructures by adjusting the atomic ratio of the plating solution. The Ni-W layer is further coated with a 50 nm Au layer to prevent oxidation. Solid-phase transient soldering is realized by combining the Au/Ni-W multilayer thin-film-modified Cu substructures with commercial solder (SAC305) for a holding time of 3 s at a soldering pressure of 10,000 gf (20 MPa) while ultrasonically assisted. The soldered samples are aged at 180 °C for 10 min, 30 min, and 60 min, respectively. Copper substructures with different surface modifications are subjected to destructive shear experiments with solder balls. Scanning electron microscope and X-ray fluorescence thickness gauge are used to study the microstructure, intermetallic compound (IMC) composition thickness and properties of the soldered interface and section. The cone height of the Cu-based structure is 2-4 µm, and the diameter of the bottom is 800 nm-1200 nm, which has a sharp tip and an excellent L/D ratio. The interface between the Au/Ni-W modified Cu substructure and the solder ball is almost free of holes. The average shear strength at the soldering interface is about 43.06 MPa. The fracture surface after the shear experiment basically occurs inside the solder ball matrix, which belongs to the pure toughness fracture. The interface between the Au/Ni-W-modified Cu-based structure and the solder ball is subjected to long aging treatment at 180 °C. The soldering interface showed a "bright layer". New phases are generated on the solder side above the "bright layer", while no new phases appear on the Cu substructure side below the "bright layer". The copper-based microstructure is inserted into the inside of the solder ball to form an inlay and produce mechanical interlocking. Au/Ni-W alloy modification layer can effectively improve the surface hardness of copper-based structures. This creates a large hardness difference with soft solder and enables the formation of fewer holes in the insertion solder. Amorphous Ni-W alloys are prone to form dense oxide films during ultrasonication. The Au film modification prevents oxide generation and increases the average shear strength of the soldering interface. The Ni-W alloy layer retards the interdiffusion between Cu-Sn, blocks the excessive growth of Cu-Sn IMCs, and reduces the reliability problems caused by interface failure.

Rapid Detection of Cleanliness on Direct Bonded Copper Substrate by Using UV Hyperspectral Imaging.

In the manufacturing process of electrical devices, ensuring the cleanliness of technical surfaces, such as direct bonded copper substrates, is crucial. An in-line monitoring system for quality checking must provide sufficiently resolved lateral data in a short time. UV hyperspectral imaging is a promising in-line method for rapid, contactless, and large-scale detection of contamination; thus, UV hyperspectral imaging (225-400 nm) was utilized to characterize the cleanliness of direct bonded copper in a non-destructive way. In total, 11 levels of cleanliness were prepared, and a total of 44 samples were measured to develop multivariate models for characterizing and predicting the cleanliness levels. The setup included a pushbroom imager, a deuterium lamp, and a conveyor belt for laterally resolved measurements of copper surfaces. A principal component analysis (PCA) model effectively differentiated among the sample types based on the first two principal components with approximately 100.0% explained variance. A partial least squares regression (PLS-R) model to determine the optimal sonication time showed reliable performance, with R2cv = 0.928 and RMSECV = 0.849. This model was able to predict the cleanliness of each pixel in a testing sample set, exemplifying a step in the manufacturing process of direct bonded copper substrates. Combined with multivariate data modeling, the in-line UV prototype system demonstrates a significant potential for further advancement towards its application in real-world, large-scale processes.

Site-selective core/shell deposition of tin on multi-segment nanowires for magnetic assembly and soldered interconnection.

The field of nanotechnology continues to grow with the ongoing discovery and characterization of novel nanomaterials with unconventional size-dependent properties; however, the ability to apply modern manufacturing strategies for practical device design of these nanoscale structures is significantly limited by their small size. Although interconnection has been previously demonstrated between nanoscale components, such approaches often require the use of expensive oxidation-resistant noble metal materials and time-consuming or untargeted strategies for welded interconnection such as laser ablation or plasmonic resonance across randomly oriented component networks. In this work, a three-segment gold-nickel-gold nanowire structure is synthesized using templated electrodeposition and modified via monolayer-directed aqueous chemical reduction of tin solder selectively on the gold segments. This core/shell nanowire structure is capable of directed magnetic assembly tip-to-tip and along substrate pads in network orientation. Upon infrared heating in a flux vapor atmosphere, the solder payload melts and establishes robust and highly conductive wire-wire joints. The targeted solder deposition strategy has been applied to various other multi-segment gold/nickel nanowire configurations and other metallic systems to demonstrate the capability of the approach. This core/shell technique of pre-loading magnetically active nanowires with solder material simplifies the associated challenges of size-dependent component orientation in the manufacture of nanoscale electronic devices.

Numerical Study on Mechanical Behavior and Electromechanical Properties of Solder-Jointed REBCO-Coated Conductors.

As the second-generation high-temperature superconducting conductors, rare earth-barium-copper-oxide (REBCO) coated conductor (CC) tapes have good potential as high-field and high-energy superconductors. In superconducting applications, several joints are required for conjugating comparatively short REBCO CC tapes. Soldering lap joints are the simplest and most commonly applied REBCO CC joints. In addition to joint resistance, the mechanical behavior and electromechanical properties are also crucial for superconducting applications. In this paper, the electromechanical properties and mechanical behaviors of soldering lap joints at 77 K under a self-field were studied. The mechanical behavior was addressed by using a full three-dimensional multilayer elastic-plastic finite element model (FEM) with REBCO CC tape main layers and solder connecting layers. Then, the electromechanical properties were analyzed by using Gao's strain-Ic degradation general model on the basis of the FEM results. Both the mechanical behavior and electromechanical properties were verified by experimental results. The effects of soldering lap conditions including lap length, soldering thickness and lap style on the electromechanical properties and mechanical behaviors were discussed. The results indicate that shorter overlap lengths and a thinner solder can reduce the premature degradation of Ic due to stress concentrations nearby the joint edges; moreover, the irreversible critical strain is significantly higher in the back-to-back joint approach compared to the widely used face-to-face joint approach.

Combined Experimental and Numerical Modelling of the Electrical Behaviour of Laser-Soldered Steel Sheets.

The electric vehicle (EV) industry challenges battery joining technologies by requiring higher energy density both by mass and volume. Improving the energy density via new battery chemistry would be the holy grail but is seriously hindered and progresses slowly. In the meantime, alternative ways, such as implementing more efficient cell packaging by minimising the electrical resistance of joints, are of primary focus. In this paper, we discuss the challenges associated with the electrical characterisation of laser-soldered joints in general, and the minimisation of their resistive losses, in particular. In order to assess the impact of joint resistance on the overall resistance of the sample, the alteration in resistance was monitored as a function of voltage probe distance and modelled by finite element simulation. The experimental measurements showed two different regimes: one far from the joint area and another in its vicinity and within the joint cross-section. The presented results confirm the importance of the thickness of the filler material, the effective and total soldered area, and the area and position of the voids within the total soldered area in determining the electrical resistance of joints.

Soldering Pressure Effect on Lifetime of Thermoelectric Modules under Thermal Cycling.

For practical industrial applications, enhancing the longevity and the reliability of thermoelectric modules (TEMs) is equally as crucial as improving their conversion efficiency. This study proposes a strategy for extending the lifespan and introduces the quality evaluation criteria for the most extensively used commercial bismuth telluride TEM. By varying the soldering pressure during module assembly, its impact on the quality of the module's internal interfacial connections was investigated, via analyzing its contact resistivity, shear modulus, and antifatigue ability through thermal cycling tests. The findings reveal that increasing the soldering pressure leads to a slight reduction in interfacial contact resistivity and has no significant effect on the shear modulus but notably enhances the module's antifatigue ability during thermal cycling tests. According to the SEM results, it can be evidently deduced that the aforementioned phenomena are directly correlated with the size and quantity of voids distributed in the solder layer, which is regarded as the origin of antifatigue ability. Thus, it can be inferred that augmenting the soldering pressure represents an effective approach to prolonging the lifespan of TEMs assembled by using the soldering method. Furthermore, the existence of voids within the solder layer can serve as a criterion for an initial assessment of module longevity. This study provides a reference for both the industrial assembly and lifespan evaluation of commercial bismuth telluride TEMs.

Low temperature soldering technology based on superhydrophobic copper microlayer.

Cu-Cu soldering is realized under certain pressure and low temperature conditions by using a surface silver film to modify the copper microlayer structure, thus solving the problems of high thermal stress and signal delay aggravation caused by high temperature in the traditional reflow soldering process. The copper microlayer modified with silver film is obtained by electrodeposition. The surface substructure of the Cu microlayer is a nano cone-shaped protrusion. The diameter of the bottom of the cone is 500 nm∼1 µm, and the height of the cone is 1∼2 µm. The thickness of the silver film is about 320 nm, and the modification of the copper layer with silver film can effectively prevent the oxidation of the copper layer. Two silver-modified copper microlayers are placed in face-to-face contact as a soldering couple. A certain pressure and low temperature are applied to the contact area to realize the soldering and interconnection. The morphology of the soldered interface and the average shear strength of the soldered joints are analyzed by scanning electron microscopy, transmission electron microscopy and solder joint tester. It is found that under the optimal soldering parameters of soldering temperature 220 °C, soldering pressure 20 MPa and soldering time 20 min, the nano-conical projections of the Cu micrometer layer are inserted into each other to produce a physical blocking effect. The highly surface-meltable silver film effectively connects the surrounding copper layer as an intermediate buffer layer. The average shear strength of soldering joints is significantly increased. Heat treatment experiments have shown that the average shear strength can be effectively increased by heat treatment for an appropriate period of time. Prolonged exposure to heat has little effect on the average shear strength. With the special morphology of the copper microlayer structure and the nano-size effect of the silver layer, soldering can be done at low temperatures. The quality of the soldering interface is good and small soldering dimensions can be obtained.

Multifunctional Hybrid Material for Endoprosthetic Implants Based on Alumina-Toughened Zirconia Ceramics and Additively Manufactured TiNbTa Alloys.

Aseptic implant loosening after a total joint replacement is partially influenced by material-specific factors when cobalt-chromium alloys are used, including osteolysis induced by wear and corrosion products and stress shielding. Here, we aim to characterize a hybrid material consisting of alumina-toughened zirconia (ATZ) ceramics and additively manufactured Ti-35Nb-6Ta (TiNbTa) alloys, which are joined by a glass solder. The structure of the joint, the static and fatigue shear strength, the influence of accelerated aging, and the cytotoxicity with human osteoblasts are characterized. Furthermore, the biomechanical properties of the functional demonstrators of a femoral component for total knee replacements are evaluated. The TiNbTa-ATZ specimens showed a homogenous joint with statistically distributed micro-pores and a slight accumulation of Al-rich compounds at the glass solder-TiNbTa interface. Shear strengths of 26.4 ± 4.2 MPa and 38.2 ± 14.4 MPa were achieved for the TiNbTa-ATZ and Ti-ATZ specimens, respectively, and they were not significantly affected by the titanium material used, nor by accelerated aging (p = 0.07). All of the specimens survived 107 cycles of shear loading to 10 MPa. Furthermore, the TiNbTa-ATZ did not impair the proliferation and metabolic activity of the human osteoblasts. Functional demonstrators made of TiNbTa-ATZ provided a maximum bearable extension-flexion moment of 40.7 ± 2.2 Nm. The biomechanical and biological properties of TiNbTa-ATZ demonstrate potential applications for endoprosthetic implants.

Interfacial reaction of Sn-1.5Ag-2.0Zn low-silver lead-free solder with oriented copper.

High density packaging technology reduces the pad size and the number of grains contained in the pad. When the polycrystalline pad turns into a single crystal pad, the grain orientation has an important impact on the formation of the intermetallic compound (IMC) at the interface. The growth of IMC at the interface between the solder and the single-crystal copper substrate is investigated by selecting the prospective Sn-1.5Ag-2Zn as the solder alloy. Sn-1.5Ag-2.0Zn lead-free solder joints soldered with single crystal (111) copper substrate and polycrystalline red copper substrate are reflowed at 250 °C for 5 min. Samples are subsequently aged at 160 °C. The uneven scallop like Cu6Sn5 IMC layer grows rapidly when the alloy solder contacts with the copper substrate. The Cu6Sn5 grain size formed on the surface of single crystal copper is larger than that of polycrystalline copper. Single crystal copper has no grain boundary to block atomic diffusion, which affects grain nucleation and growth. The growth rate of Cu6Sn5 formed by alloy solder and the single crystal (111) copper solder joint after aging treatment at 160 °C for 20 h is about twice that of the polycrystalline copper solder joint. Then it grows slowly with the increase of aging treatment time. The thick layer Cu6Sn5 breaks due to crack diffusion after 600 h of aging treatment, and the thickness of IMC remains at 3.5 µm. Cu5Zn8 generated at the solder and polycrystalline copper solder joint during aging treatment acts as a barrier layer, preventing the solder from contacting the copper substrate and inhibiting the formation of Cu6Sn5. Cu5Zn8 is broken and decomposed after 300 h of aging treatment, and Cu6Sn5 grows rapidly after the barrier layer disappeared. The thickness of Cu6Sn5 is about 2.8 µm. The thickness of IMC of solder joint on single crystal copper is 0.7 µm more than that on polycrystalline copper. After aging treatment, the IMC formed at the interface between alloy solder and single crystal copper has better compactness and basically no pores, while there are obvious pores between IMC grains at the interface between alloy solder and polycrystalline copper, which can predict that the soldering quality of the interface between alloy solder and single crystal copper is better. This will provide application prospects for solder joint interface reliability research.

Improvement of Solder Joint Shear Strength under Formic Acid Atmosphere at A Low Temperature.

With the continuous reduction of chip size, fluxless soldering has brought attention to high-density, three-dimensional packaging. Although fluxless soldering technology with formic acid (FA) atmosphere has been presented, few studies have examined the effect of the Pt catalytic, preheating time, and soldering pad on FA soldering for the Sn-58Bi solder. The results have shown that the Pt catalytic can promote oxidation-reduction and the formation of a large pore in the Sn-58Bi/Cu solder joint, which causes a decrease in shear strength. ENIG (electroless nickel immersion gold) improves soldering strength. The shear strength of Sn-58Bi/ENIG increases under the Pt catalytic FA atmosphere process due to the isolation of the Au layer on ENIG. The Au layer protects metal from corrosion and provides a good contact surface for the Sn-58Bi solder. The shear strength of the Sn-58Bi/ENIG joints under a Pt catalytic atmosphere improved by 44.7% compared to using a Cu pad. These findings reveal the improvement of the shear strength of solder joints bonded at low temperatures under the FA atmosphere.

Data of automated optical inspection of surface-mounted technology electronic production.

A popular soldering technique for printed circuit boards (PCB) is the so-called surface-mounted technology. After the soldering process an automated optical inspection (AOI) is the common method determining whether a PCB shall go to a manual inspection and rework station (MIS) or can directly go further to the next process step. Thereby, the AOI is a vision-based system deriving user defined physical measurements from a camera image. Based on these pre-defined measurements associated with static specification limits, the AOI labels each inspected soldering spot on a PCB as non-defect or defect. However, a large majority of PCBs are wrongly labelled defect, so-called false calls, causing a major manual labour effort at the MIS. This dataset contains a 132-days recording of PCBs going through the MIS labelled as true defect or false call with the physical measurement by the AOI. Furthermore, the dataset may contain various distribution drifts of unknown type that can be explained by the high sensitivity of electronic production to small external factors that may change unrecognized and additionally the dataset has an unknown percentage of label error due the human labelling process.

Advanced Analysis of the Properties of Solid-Wire Electric Contacts Produced by Ultrasonic Welding and Soldering.

The current article presents an advanced analysis of the properties of solid-wire electric contacts produced with ultrasonic welding and soldering. Soldering is generally used to join thin, solid copper wires to produce electrical contacts in small-volume production, as ultrasonic welding does not provide acceptable peel force and tensile strength due to the deformation and thinning of the wires. In this article, ultrasonic welding of thin, solid copper wires using a ring before and after a thermal shock test is discussed and compared with the standard soldering technique. The thermal shock test was carried out in the temperature range from -30 to 150 °C. Half of the samples, for both the joining techniques and the wires, were subjected to the thermal shock test; the other half were not. Investigations included electrical resistance tests, optical and SEM microscopy, XRD, microhardness measurements, peel tests, tensile tests, and fractographic analysis. The electrical resistance test, microscopy, microhardness measurements, and fracture examinations showed no differences between the thermal shock-exposed and the non-exposed samples with the same joining process. In mechanical tests, the ultrasonic joint demonstrated superior strength compared to the soldered joint.

The effect of pre-ceramic soldering on marginal and internal fit of 4-unit zirconia frameworks and monolithic zirconia fixed dental prostheses.

The aim of this study is to evaluate the effect of pre-ceramic soldering on the marginal and internal fit of 4-unit zirconia fixed dental prostheses (FPDs) that have two abutments and two pontics. 4-unit zirconia frameworks (Zirkonzahn ICE Translucent) (Z Group) and monolithic zirconia (Zirkonzahn Prettau) (M Group) FPDs were manufactured. Groups were divided into two groups (n = 10) control (ZC and MC) and soldering (ZS and MS). Samples of ZS and MS groups were cut into two pieces under cooling water and soldered with a bonding material (DCM Zircon HotBond). The marginal and internal fit of the restorations were measured from 36 points of each sample and cement space volume was calculated using reverse engineering software (Geomagic Design X). The mean and standard deviations were submitted to Generalized Linear Mixed Model (GLMM) analysis (α = 0.05). Statistical differences between groups before and after pre-ceramic soldering on point measurements were found. In total cement spacing measurements, a significant difference was found amongst all groups (P < 0.05). However, in premolars, a statistically significant difference was found between ZC and ZS groups and MC and MS groups (P < 0.05). All discrepancies after pre-ceramic soldering were found to be lower than before.

Strong Connection of Single-Wall Carbon Nanotube Fibers with a Copper Substrate Using an Intermediate Nickel Layer.

Lightweight carbon nanotube fibers (CNTFs) with high electrical conductivity and high tensile strength are considered to be an ideal wiring medium for a wide range of applications. However, connecting CNTFs with metals by soldering is extremely difficult due to the nonreactive nature and poor wettability of CNTs. Here we report a strong connection between single-wall CNTFs (SWCNTFs) and a Cu matrix by introducing an intermediate Ni layer, which enables the formation of mechanically strong and electrically conductive joints between SWCNTFs and a eutectic Sn-37Pb alloy. The electrical resistance change rate (ΔR/R0) of Ni-SWCNTF/solder-Cu interconnects only decreases ∼29.8% after 450 thermal shock cycles between temperatures of -196 and 150 °C, which is 8.2 times lower than that without the Ni layer. First-principles calculations indicate that the introduction of the Ni layer significantly improves the heterogeneous interfacial bond strength of the Ni-SWCNTF/solder-Cu connections.

Effect of Thermal Aging on the Interfacial Reaction Behavior and Failure Mechanism of Ni-xCu/Sn Soldering Joints under Shear Loading.

Ni-xCu/Sn soldering joints were aged at 200 °C, and the microstructure evolution and mechanical properties during the solid-state reaction were studied under shear loading. Results showed that the intermetallic compounds (IMCs) exhibited a Cu content-dependent transformation from the (Ni,Cu)3Sn4 phase to the (Cu,Ni)6Sn5 phase at the Ni-xCu/Sn interface. Furthermore, a Cu3Sn layer was observed exclusively at the Cu/Sn interface. The shear strength of the soldering joints after thermal aging exhibited an initial decrease followed by an increase, except for a significant enhancement at the Cu content of 60 wt.%. In addition, the evolution law of mechanical properties and failure mechanism of the thermal aging joints were elucidated based on the fracture microstructure and the fracture curve of the joints.

Variable-Structure Proportional-Integral-Derivative Laser Solder Joint Temperature Intelligent Control Method with Adjustable Power Upper Limit.

Laser soldering is a crucial soldering technique in the realm of electronic assembly. The temperature of the solder joint is intimately connected with the quality of the solder. This paper introduces an adjustable power upper limit variable-structure Proportional-Integral-Derivative (PID) intelligent control method for regulating the temperature of the solder joint during laser soldering. Distinct laser power limits are employed for workpieces with varying heat capacities. The solder joint temperature is monitored through an infrared thermometer, which enables closed-loop temperature control via a variable-structure PID algorithm. Residual neural network (ResNet) models are utilized to predict key soldering process parameters. This method has been executed and validated on a practical testing platform. Compared to other laser soldering control techniques, the proposed method demonstrates a low overshoot, rapid dynamic response, and swift adjustment capabilities, effectively enhancing the soldering quality and production efficiency.

Effects of Multiple Reflow on the Formation of Primary Crystals in Sn-3.5Ag and Solder Joint Strength: Experimental and Finite Element Analysis.

The growth and formation of primary intermetallics formed in Sn-3.5Ag soldered on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish after multiple reflows were systematically investigated. Real-time synchrotron imaging was used to investigate the microstructure, focusing on the in situ growth behavior of primary intermetallics during the solid-liquid-solid interactions. The high-speed shear test was conducted to observe the correlation of microstructure formation to the solder joint strength. Subsequently, the experimental results were correlated with the numerical Finite Element (FE) modeling using ANSYS software to investigate the effects of primary intermetallics on the reliability of solder joints. In the Sn-3.5Ag/Cu-OSP solder joint, the well-known Cu6Sn5 interfacial intermetallic compounds (IMCs) layer was observed in each reflow, where the thickness of the IMC layer increases with an increasing number of reflows due to the Cu diffusion from the substrate. Meanwhile, for the Sn-3.5Ag/ENIG solder joints, the Ni3Sn4 interfacial IMC layer was formed first, followed by the (Cu, Ni)6Sn5 IMC layer, where the formation was detected after five cycles of reflow. The results obtained from real-time imaging prove that the Ni layer from the ENIG surface finish possessed an effective barrier to suppress and control the Cu dissolution from the substrates, as there is no sizeable primary phase observed up to four cycles of reflow. Thus, this resulted in a thinner IMC layer and smaller primary intermetallics, producing a stronger solder joint for Sn-3.5Ag/ENIG even after the repeated reflow process relative to the Sn-3.5Ag/Cu-OSP joints.

Study on Corrosion Resistance of Stainless-Steel Welded Joints with SnSb8Cu4 and SnZn9.

The use of soldering based on metallurgical bonding, as opposed to conventional rubber sealing, is capable of achieving the firm sealing of stainless-steel subway car bodies, though the corrosion resistance of such joints has rarely been investigated. In this study, two typical solders were selected and applied to the soldering of stainless steel, and their properties were investigated. As indicated by the experimental results, the two types of solder exhibited favorable wetting and spreading properties on stainless-steel plates, and successfully achieved sealing connections between the stainless-steel sheets. In comparison with the Sn-Zn9 solder, the Sn-Sb8-Cu4 solder exhibited lower solidus-liquidus, such that it can be more suitably applied to low-temperature sealing brazing. The sealing strength of the two solders reached over 35 MPa, notably higher than that of the sealant currently used (the sealing strength is lower than 10 MPa). In comparison with the Sn-Sb8-Cu4 solder, the Sn-Zn9 solder exhibited a higher corrosion tendency and a higher degree of corrosion during the corrosion process.

Artifact-Free Microstructures in the Interfacial Reaction between Eutectic In-48Sn and Cu Using Ion Milling.

Eutectic In-48Sn was considered a promising candidate for low-temperature solder due to its low melting point and excellent mechanical properties. Both Cu2(In,Sn) and Cu(In,Sn)2 formation were observed at the In-48Sn/Cu interface after 160 °C soldering. However, traditional mechanical polishing produces many defects at the In-48Sn/Cu interface, which may affect the accuracy of interfacial reaction investigations. In this study, cryogenic broad Ar+ beam ion milling was used to investigate the interfacial reaction between In-48Sn and Cu during soldering. The phase Cu6(Sn,In)5 was confirmed as the only intermetallic compound formed during 150 °C soldering, while Cu(In,Sn)2 formation was proven to be caused by room-temperature aging after soldering. Both the Cu6(Sn,In)5 and Cu(In,Sn)2 phases were confirmed by EPMA quantitative analysis and TEM selected area electron diffraction. The microstructure evolution and growth mechanism of Cu6(Sn,In)5 during soldering were proposed. In addition, the Young's modulus and hardness of Cu6(Sn,In)5 were determined to be 119.04 ± 3.94 GPa and 6.28 ± 0.13 GPa, respectively, suggesting that the doping of In in Cu6(Sn,In)5 has almost no effect on Young's modulus and hardness.

Microwave Soldering of Low-Resistance Conductive Joints-Technical and Economic Aspects.

Soldering processes are applied in the fabrication of electronic circuits used in most modern domestic and industrial technologies. This article aims to introduce a new soldering technology based on the microwave joining of copper materials used in electronic applications. The study was focused on microwave technology used as the thermal source for soldering. A simulation model of temperature distributions in copper plates with overall dimensions of 50 × 10 × 0.8 mm was developed in order to determine the necessary microwave power for soldering. For 270 °C simulated on the surface of copper plates, the microwave-injected power was determined to be 598.89 W. An experimental program for 600, 650, 700, and 750 W was set in order to achieve soldering of copper plates in less than 1 min. Soldered copper plates were subject to electrical resistance measurements being obtained with variations up to ±1.5% of the initial electrical resistance of the base materials. The quality of joints has also been analyzed through microscopy after the soldering process. In addition, mechanical properties were determined using a universal testing machine. The results have shown similar behavior of the samples layered with SAC on the one-side and double-side but also a significantly lower force before breaking for one-side-layered samples. An economic analysis was performed and the results obtained have shown that in terms of energy efficiency and total costs for microwave soldering compared with manual soldering, microwave soldering is cost-effective for industrial processing.