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Effect of interfacial condition on electromigration for narrow and wide copper interconnects.
Cheng, Yi-Lung; Wang, Ying-Lang.
Affiliation
  • Cheng YL; Department of Electrical Engineering, National Chi-Nan University, Nan-Tou, Taiwan.
J Nanosci Nanotechnol ; 8(5): 2494-9, 2008 May.
Article in En | MEDLINE | ID: mdl-18572672
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Collection: 01-internacional Database: MEDLINE Language: En Journal: J Nanosci Nanotechnol Year: 2008 Document type: Article Affiliation country: Taiwan Country of publication: United States
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Collection: 01-internacional Database: MEDLINE Language: En Journal: J Nanosci Nanotechnol Year: 2008 Document type: Article Affiliation country: Taiwan Country of publication: United States