Your browser doesn't support javascript.
loading
Microstructure and formation of copper oxide in the Cu electro-polishing process.
Kung, Te-Ming; Huang, Michael Rong-Shie; Tsao, Jung-Chih; Liu, Chuan-Pu; Wang, Ying-Lang.
Affiliation
  • Kung TM; Department of Materials Science and Engineering, National Chen-Kung University, Tainan 701, Taiwan, Republic of China.
J Nanosci Nanotechnol ; 10(11): 7065-9, 2010 Nov.
Article in En | MEDLINE | ID: mdl-21137866
Search on Google
Add to My VHL
Print
XML
PubMed Links

Collection: 01-internacional Database: MEDLINE Language: En Journal: J Nanosci Nanotechnol Year: 2010 Document type: Article Affiliation country: China Country of publication: United States
Search on Google
Add to My VHL
Print
XML
PubMed Links

Collection: 01-internacional Database: MEDLINE Language: En Journal: J Nanosci Nanotechnol Year: 2010 Document type: Article Affiliation country: China Country of publication: United States