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Investigation the electroplating behavior of self formed CuMn barrier.
Wu, Chia-Yang; Lee, Wen-Hsi; Chang, Shih-Chieh; Wang, Ying-Lang.
Affiliation
  • Wu CY; Department of Electrical Engineering, National Cheng Kung University, Tainan 701, Taiwan, ROC.
J Nanosci Nanotechnol ; 13(8): 5800-6, 2013 Aug.
Article in En | MEDLINE | ID: mdl-23882838
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Collection: 01-internacional Database: MEDLINE Language: En Journal: J Nanosci Nanotechnol Year: 2013 Document type: Article Country of publication: United States
Search on Google
Add to My VHL
Print
XML
PubMed Links

Collection: 01-internacional Database: MEDLINE Language: En Journal: J Nanosci Nanotechnol Year: 2013 Document type: Article Country of publication: United States