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Low-Temperature Copper Bonding Strategy with Graphene Interlayer.
Wang, Haozhe; Leong, Wei Sun; Hu, Fengtian; Ju, Longlong; Su, Cong; Guo, Yukun; Li, Ju; Li, Ming; Hu, Anmin; Kong, Jing.
Affiliation
  • Wang H; Department of Electrical Engineering and Computer Science , Massachusetts Institute of Technology , Cambridge , Massachusetts 02139 , United States.
  • Leong WS; Department of Electrical Engineering and Computer Science , Massachusetts Institute of Technology , Cambridge , Massachusetts 02139 , United States.
  • Hu F; School of Materials Science and Engineering , Shanghai Jiao Tong University , Shanghai , 200240 , China.
  • Ju L; School of Materials Science and Engineering , Shanghai Jiao Tong University , Shanghai , 200240 , China.
  • Su C; Department of Nuclear Science and Engineering , Massachusetts Institute of Technology , Cambridge , Massachusetts 02139 , United States.
  • Guo Y; School of Materials Science and Engineering , Shanghai Jiao Tong University , Shanghai , 200240 , China.
  • Li J; Department of Nuclear Science and Engineering , Massachusetts Institute of Technology , Cambridge , Massachusetts 02139 , United States.
  • Li M; School of Materials Science and Engineering , Shanghai Jiao Tong University , Shanghai , 200240 , China.
  • Hu A; School of Materials Science and Engineering , Shanghai Jiao Tong University , Shanghai , 200240 , China.
  • Kong J; Department of Electrical Engineering and Computer Science , Massachusetts Institute of Technology , Cambridge , Massachusetts 02139 , United States.
ACS Nano ; 12(3): 2395-2402, 2018 03 27.
Article in En | MEDLINE | ID: mdl-29370518

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: ACS Nano Year: 2018 Document type: Article Affiliation country: United States Country of publication: United States

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: ACS Nano Year: 2018 Document type: Article Affiliation country: United States Country of publication: United States