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In situ growth of Z-scheme CuS/CuSCN heterojunction to passivate surface defects and enhance charge transport.
Ning, Pei; Liang, Junhui; Li, Linghui; Chen, Da; Qin, Laishun; Yao, Xin; Chen, Huayu; Huang, Yuexiang.
Affiliation
  • Ning P; College of Materials and Chemistry, China Jiliang University, Hangzhou 300018, Zhejiang, China.
  • Liang J; College of Materials and Chemistry, China Jiliang University, Hangzhou 300018, Zhejiang, China. Electronic address: nkljhyx@163.com.
  • Li L; College of Materials and Chemistry, China Jiliang University, Hangzhou 300018, Zhejiang, China.
  • Chen D; College of Materials and Chemistry, China Jiliang University, Hangzhou 300018, Zhejiang, China. Electronic address: dchen_80@hotmail.com.
  • Qin L; College of Materials and Chemistry, China Jiliang University, Hangzhou 300018, Zhejiang, China.
  • Yao X; College of Optical and Electronic Technology, China Jiliang University, Hangzhou 300018, Zhejiang, China.
  • Chen H; College of Materials and Chemistry, China Jiliang University, Hangzhou 300018, Zhejiang, China.
  • Huang Y; College of Materials and Chemistry, China Jiliang University, Hangzhou 300018, Zhejiang, China.
J Colloid Interface Sci ; 590: 407-414, 2021 May 15.
Article in En | MEDLINE | ID: mdl-33561590
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: J Colloid Interface Sci Year: 2021 Document type: Article Affiliation country: China Country of publication: United States
Fulltext
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: J Colloid Interface Sci Year: 2021 Document type: Article Affiliation country: China Country of publication: United States