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Surface Modification Using Assisting Electrodes in Wire Electrical Discharge Machining for Silicon Wafer Preparation.
Kuo, Chunliang; Nien, Yupang; Chiang, Anchun; Hirata, Atsushi.
Affiliation
  • Kuo C; Department of Mechanical Engineering, National Taiwan University of Science and Technology, #43, Sec. 4, Keelung Road, Taipei 106, Taiwan.
  • Nien Y; Department of Mechanical Engineering, National Taiwan University of Science and Technology, #43, Sec. 4, Keelung Road, Taipei 106, Taiwan.
  • Chiang A; Department of Mechanical Engineering, National Taiwan University of Science and Technology, #43, Sec. 4, Keelung Road, Taipei 106, Taiwan.
  • Hirata A; School of Engineering, Tokyo Institute of Technology, 2-12-1 Ookayama, Meguro-ku, Tokyo 152-8550, Japan.
Materials (Basel) ; 14(6)2021 Mar 11.
Article in En | MEDLINE | ID: mdl-33799619
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Materials (Basel) Year: 2021 Document type: Article Affiliation country: Taiwan Country of publication: Switzerland
Fulltext
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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Materials (Basel) Year: 2021 Document type: Article Affiliation country: Taiwan Country of publication: Switzerland