Breakage Ratio of Silicon Wafer during Fixed Diamond Wire Sawing. | Micromachines (Basel);13(11)2022 Nov 02. | MEDLINE

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Breakage Ratio of Silicon Wafer during Fixed Diamond Wire Sawing.

Liu, Tengyun; Su, Yancai; Ge, Peiqi.

Affiliation

Liu T; Faculty of Mechanical Engineering, Qilu University of Technology (Shandong Academy of Sciences), Jinan 250000, China.
Su Y; Faculty of Mechanical Engineering, Qilu University of Technology (Shandong Academy of Sciences), Jinan 250000, China.
Ge P; School of Mechanical Engineering, Shandong University, Jinan 250000, China.

Micromachines (Basel) ; 13(11)2022 Nov 02.

Article in En | MEDLINE | ID: mdl-36363919

Key words

breakage ratio; fixed diamond wire saw; forced vibration; silicon wafer

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Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Micromachines (Basel) Year: 2022 Document type: Article Affiliation country: China Country of publication: Switzerland

Search on Google

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Micromachines (Basel) Year: 2022 Document type: Article Affiliation country: China Country of publication: Switzerland