Your browser doesn't support javascript.
loading
An integrated ultra-high vacuum cluster for atomic-scale deposition, interface regulation, and characterization of spintronic multilayers.
Cheng, Houyi; Zhang, Boyu; Eimer, Sylvain; Liu, Yongshan; Xu, Yong; Vallobra, Pierre; Wang, Zilu; Li, Cheng; Ge, Jiyao; Xu, Renyou; Yao, Yuxuan; Wang, Xinran; Du, Yinchang; Zhang, Xueying; Zhang, Yue; Zhao, Chao; Zhao, Weisheng.
Affiliation
  • Cheng H; MIIT Key Laboratory of Spintronics, School of Integrated Circuit Science and Engineering, Beihang University, Beijing 100191, China.
  • Zhang B; Hefei Innovation Research Institute, Anhui High Reliability Chips Engineering Laboratory, Beihang University, Hefei 230013, China.
  • Eimer S; Truth Equipment Corporation, TREC, Hefei 230013, China.
  • Liu Y; MIIT Key Laboratory of Spintronics, School of Integrated Circuit Science and Engineering, Beihang University, Beijing 100191, China.
  • Xu Y; Hefei Innovation Research Institute, Anhui High Reliability Chips Engineering Laboratory, Beihang University, Hefei 230013, China.
  • Vallobra P; Hefei Innovation Research Institute, Anhui High Reliability Chips Engineering Laboratory, Beihang University, Hefei 230013, China.
  • Wang Z; Truth Equipment Corporation, TREC, Hefei 230013, China.
  • Li C; MIIT Key Laboratory of Spintronics, School of Integrated Circuit Science and Engineering, Beihang University, Beijing 100191, China.
  • Ge J; Hefei Innovation Research Institute, Anhui High Reliability Chips Engineering Laboratory, Beihang University, Hefei 230013, China.
  • Xu R; MIIT Key Laboratory of Spintronics, School of Integrated Circuit Science and Engineering, Beihang University, Beijing 100191, China.
  • Yao Y; Hefei Innovation Research Institute, Anhui High Reliability Chips Engineering Laboratory, Beihang University, Hefei 230013, China.
  • Wang X; Hefei Innovation Research Institute, Anhui High Reliability Chips Engineering Laboratory, Beihang University, Hefei 230013, China.
  • Du Y; MIIT Key Laboratory of Spintronics, School of Integrated Circuit Science and Engineering, Beihang University, Beijing 100191, China.
  • Zhang X; Hefei Innovation Research Institute, Anhui High Reliability Chips Engineering Laboratory, Beihang University, Hefei 230013, China.
  • Zhang Y; Truth Equipment Corporation, TREC, Hefei 230013, China.
  • Zhao C; Hefei Innovation Research Institute, Anhui High Reliability Chips Engineering Laboratory, Beihang University, Hefei 230013, China.
  • Zhao W; Truth Equipment Corporation, TREC, Hefei 230013, China.
Rev Sci Instrum ; 94(7)2023 Jul 01.
Article in En | MEDLINE | ID: mdl-37432097
Fulltext
Add to My VHL
Print
XML
PubMed Links
Search on Google

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Rev Sci Instrum Year: 2023 Document type: Article Affiliation country: China Country of publication: United States
Fulltext
Add to My VHL
Print
XML
PubMed Links
Search on Google

Full text: 1 Collection: 01-internacional Database: MEDLINE Language: En Journal: Rev Sci Instrum Year: 2023 Document type: Article Affiliation country: China Country of publication: United States